Guard Ring Layout for ESD-Robust Programmable Semiconductor Cells

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Solution Overview

Problem

The scaling down of semiconductor devices poses challenges in achieving improved quality, yield, performance, and reliability while reducing complexity, particularly in managing electrostatic discharge effectively.

Innovation Solution

The semiconductor device design incorporates a guard ring structure with opposite electrical types positioned in surrounding areas and a programmable unit featuring a U-shaped cross-sectional profile, including a common layer, connection layer, and electrode layers, which enhances electrostatic discharge capability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If semiconductor device dimensions are scaled down to meet increasing computing demand, then device density and computing ability are improved, but electrostatic discharge management becomes more difficult and reliability deteriorates

Engineering Contradiction:
Improvecomputing abilityVSAvoidelectrostatic discharge management
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The device is divided into distinct functional regions: a center area containing programmable units and surrounded by isolation layers, with guard rings positioned in surrounding areas. This segmentation isolates electrostatic discharge paths from the core computing elements, allowing scaling while protecting against ESD damage.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Guard rings with opposite electrical types are introduced as intermediary structures between the center area and external environment. These guard rings act as mediators that intercept and dissipate electrostatic discharge before it reaches the programmable units, enabling reliable operation at scaled dimensions.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If guard rings with opposite electrical types are positioned in surrounding areas, then electrostatic discharge capability is improved, but device structure complexity increases

Engineering Contradiction:
Improveelectrostatic discharge capabilityVSAvoidstructure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The isolation layers serve multiple functions: they provide electrical isolation between the center area and surrounding regions, define the boundaries for guard ring placement, and contribute to the overall ESD protection scheme. This multi-functionality reduces the need for additional dedicated structures, thereby limiting complexity increase.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The guard rings are configured with opposite electrical types to create equipotential regions that neutralize electrostatic charges. By positioning these guard rings in surrounding areas rather than interspersing them throughout the device, the design achieves ESD protection with minimal structural complexity.

Inventive Principle:
Principle #12Equipotentiality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design improves the reliability and performance of semiconductor devices by effectively managing electrostatic discharge, addressing the challenges associated with scaling down semiconductor devices.

Implementation Method 1

the first guard ring and the second guard ring may provide capability of electrostatic discharge to the plurality of programmable units

Methodology Applied
Scientific EffectElectrostatic discharge: Electrostatic Discharge

Data Source

PatentUS12154895B2Semiconductor device with guard ring
Publication Date: 2024.11.26 NAN YA TECH
  • US12154895B2 patent drawing
  • US12154895B2 patent drawing
  • US12154895B2 patent drawing

AI summary

The present application discloses a semiconductor device. The semiconductor device includes an isolation layer positioned in a substrate to define a first surrounding area surrounding a center area; a first guard ring in the first surrounding area; and a programmable unit including: a middle insulating layer in the center area and including a U-shaped cross-sectional profile; a first electrode including a common layer on two sides of the middle insulating layer, and a connection layer including a U-shaped cross-sectional profile, on the two sides and the bottom surface of the middle insulating layer, and connecting to the common layer; and a second electrode layer on an inner surface of the middle insulating layer. A bottom surface of the common layer is at a vertical level greater than a vertical level of a bottom surface of the middle insulating layer.