Guide Plate Composite Structure for Pin Alignment and Heat Stability
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Solution Overview
Problem
Existing guide plates using anodized films as structural material face issues of fragility and thermal deformation, and deposition methods can cause bending or peeling of insulating layers, compromising the integrity and functionality of electrically conductive pins.
Innovation Solution
A guide plate with anodized films formed on both upper and lower portions of a metal substrate, utilizing the metal substrate as the structural material, which is integrated with upper and lower anodized films to enhance robustness and thermal stability, and includes a concave portion and varying opening areas to facilitate pin insertion and reduce friction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If anodized films are used as structural material for guide plates, then electrical insulation properties are improved, but material fragility and thermal deformation occur
Solution Approach 1:
The patent uses a composite structure combining metal substrate with anodized film coating. The metal substrate provides mechanical strength and thermal stability, while the anodized film provides electrical insulation properties. This composite approach resolves the contradiction by integrating the advantages of both materials.
Solution Approach 2:
The patent controls the thickness and properties of the anodized film through anodizing process parameters to achieve the desired electrical insulation while maintaining mechanical integrity. By optimizing the anodized film parameters, the material achieves both insulation and strength requirements.
2Reliability
If metal substrate is removed after anodizing, then anodized film properties are utilized, but structural strength is lost
Solution Approach 1:
The patent applies anodized film only where electrical insulation is needed (on the surface of guide holes and guide plates), while the metal substrate remains intact in structural areas to provide strength. This local application of anodized film resolves the contradiction between utilizing film properties and maintaining structural integrity.
3Reliability
If insulating layer is deposited on metal substrate, then electrical insulation is achieved, but substrate bending and layer peeling occur
Solution Approach 1:
The patent uses anodizing process instead of deposition to form the insulating layer. By controlling anodizing parameters such as electrolyte composition, temperature, and time, the anodized film is formed with proper adhesion to the metal substrate, preventing peeling and substrate bending while achieving the required electrical insulation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a robust and thermally stable guide plate that maintains positional accuracy of electrically conductive pins, prevents bending, and facilitates heat dissipation, while minimizing thermal deformation and peeling, suitable for high-temperature environments.
Implementation Method 1
a guide plate with anodized films formed on both upper and lower portions of a metal substrate
Implementation Method 2
anodized films have low thermal deformation at high temperatures and possess electrical insulation properties
Implementation Method 3
utilizing the metal substrate employed in forming the anodized film as the structural material... facilitates heat dissipation
Data Source
AI summary
The present invention provides a guide plate with an anodized film and a pin block having the same, by directly using the metal substrate, which was used to form the anodized films, as the structural material for the guide plate, thereby having anodized films on both the upper and lower portions of the metal substrate, which compensates for the vulnerability of the anodized film material.