Gyro Sensor Package Wire Segmentation and Shielding

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Solution Overview

Problem

Angular velocity sensors face noise interference issues due to the electric connection between detection wires and digital interface wires, which affects the accuracy of detection signals.

Innovation Solution

The package design includes separate arrangements for first and second wires, with digital signal wires positioned to minimize interference, and the use of ground or fixed potential wires as shield layers to further reduce noise.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If digital interface wires and detection wires are electrically connected on the package, then signal transmission between IC and outside is enabled, but noise interference occurs in detection wires affecting detection signal accuracy

Engineering Contradiction:
Improvesignal transmissionVSAvoiddetection signal accuracy
Core Design Contradiction:
Ease of operationVSMeasurement precision

Solution Approach 1:

The package surface is segmented into distinct regions: a first region for detection wires and a second region for digital interface wires. This spatial segmentation prevents electrical connection between the two types of wires, eliminating noise interference while maintaining signal transmission functionality. The detection wires are arranged in a first direction and the digital wires in a second direction, creating clear separation zones.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A ground wire or fixed potential wire is introduced as an intermediary element positioned between the detection wires and digital interface wires. This intermediary wire acts as a shield that blocks electromagnetic interference from the digital wires from affecting the detection wires, thereby maintaining detection signal accuracy while allowing both signal types to coexist on the package.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Area of stationary object

If detection wires and digital wires are arranged close together on the package, then package area is minimized, but noise interference increases affecting detection accuracy

Engineering Contradiction:
Improvepackage areaVSAvoiddetection accuracy
Core Design Contradiction:
Area of stationary objectVSReliability

Solution Approach 1:

Instead of arranging wires in a simple linear fashion, the patent uses two-dimensional directional arrangement: detection wires extend in a first direction while digital interface wires extend in a second direction. This dimensional approach allows efficient space utilization while maintaining adequate separation between wire types, preventing noise interference without significantly increasing package area.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

A ground wire or fixed potential wire is positioned between the detection wires and digital interface wires to serve as a shielding barrier. This intermediary element blocks electromagnetic coupling between the two wire groups, ensuring detection accuracy is maintained even when wires are arranged in close proximity to minimize package footprint.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS9823071B2Package, electronic component mounted package, physical quantity sensor, electronic device, and moving object
Publication Date: 2017.11.21 SEIKO EPSON CORP
  • US9823071B2 patent drawing
  • US9823071B2 patent drawing
  • US9823071B2 patent drawing

AI summary

A physical quantity sensor includes a base on which an IC electrically connected to a gyro element is arranged and a wire group arranged on the base. The base includes a first outer edge and a second outer edge that crosses the first outer edge. The wire group includes a CLK wire arranged along the first outer edge and including an internal terminal connected to the IC and an S1 wire arranged along the second outer edge and including an internal terminal connected to the IC. A detection signal of the gyro element is input to the IC via the S1 wire.