Solid-State Devices TRIZ Cases
- Superconducting TSV Interconnect Groove Layout for Reliable Chip Stacking
A groove linked to the through-silicon via enables ALD or CVD superconducting film deposition without etching damage, improving stacked-chip connections.
- MEMS Mirror Stress-Relief Structure for Wide-Angle Low-Power Scanning
Stress relief units and lever structures let a MEMS mirror reach wide scan angles at low voltage while improving breakage tolerance.
- Molded Sensor Packages With Attached Connectors for Parallel Pretesting
Compact molded packages are pretested in parallel, then fused to separate connectors to keep socket access while increasing panel density.
- MEMS Stator Interconnect Packaging for Compact Sensor Wire Bonding
A stator pad and via route sensor connections vertically, cutting long wire bonds, board area, and shorting risk in moving MEMS packages.
- MEMS Movable Mass Stopper Mechanism for Controlled Rebound
Rotating L-shaped stoppers clamp a MEMS movable mass transversely to balance stop forces, limit damage, and guide rebound direction.
- MEMS Sensor Package Isolation Structure for Thermal and Vibration Stability
An elastomer-isolated, hermetically sealed MEMS package uses flexible interconnects to limit temperature, shock, and vibration errors.
- Pressure Sensor Package Edge Venting for Contamination Resilience
Side-located vents and lid channels keep ambient airflow to the sensor cavity while reducing contaminant entry that can impair pressure accuracy.
- MEMS Sensor Packaging With Vertical Rotor Displacement
Vertical stacked MEMS packaging uses vias and short interconnects to let the sensor rotor move freely while reducing wire-bond shorting risk.
- 8T SRAM Cell Layout for Read-Write Performance Without Area Growth
An 8T SRAM cell boosts read and write performance by adding transistors and sharing source regions to avoid increasing memory cell area.
- Cap-to-Substrate Package Structure for Delamination Resistance
Reinforcement vias tie the cap ring to ground contacts, relieving thermal-cycling stress and reducing package delamination.