MEMS Sensor Packaging With Vertical Rotor Displacement
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Solution Overview
Problem
Existing MEMS devices face challenges in miniaturization and reliability due to long wire-bonds that are susceptible to movement and shorting in harsh environments, especially when the image sensor is located below the circuit board, consuming both top and bottom circuit-board area and complicating manufacturing.
Innovation Solution
A MEMS device design that utilizes an actuator rotor and stator for electrical connection, allowing the sensor to be mounted on the rotor and connected to the stator via wire bond interconnects, enabling free movement and compact packaging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the image sensor is located below the circuit board to enable movement, then the sensor can move freely relative to the circuit board, but long wire-bonds are required which are susceptible to movement and shorting in harsh environments
Solution Approach 1:
The patent transitions from a planar circuit board layout to a three-dimensional stacked architecture. The sensor is positioned above the circuit board within the actuator assembly, utilizing vertical space rather than horizontal plane. This dimensional change eliminates the need for long wire-bonds across the circuit board, as electrical connections are established through vertical vias and interconnect structures within the compact stacked package, thereby improving reliability while maintaining movement capability.
2Adaptability or versatility
If the image sensor is located below the circuit board, then movement is enabled, but both top and bottom circuit-board area is consumed complicating manufacturing
Solution Approach 1:
The invention moves the sensor from a planar location on the circuit board to a vertical stacking arrangement above the circuit board. This utilizes the Z-dimension (vertical space) rather than consuming additional X-Y plane area on the circuit board. The sensor, actuator, and circuit board are stacked vertically with interconnects through vias, enabling compact packaging without complicating circuit board layout and manufacturing.
3Adaptability or versatility
If long wire-bonds are used to connect the sensor to the circuit board, then sensor movement is possible, but the risk of bond-to-bond shorting increases in harsh environments
Solution Approach 1:
The patent extracts the wire-bond interconnect function from the traditional long horizontal wire-bonds across the circuit board and replaces it with vertical electrical interconnects through vias and conductive structures within the stacked package. This extraction eliminates the long wire-bond pathways that are susceptible to movement-induced shorting, while the sensor retains mobility through its suspension in the actuator assembly above the circuit board.
Data Source
AI summary
A MEMS device includes an electrical distribution substrate and a spacer ring extending upward therefrom. An actuator stator is positioned above the electrical distribution substrate and within the spacer ring. An outer frame extends from a floor of the actuator stator. An actuator rotor is suspended above the floor. A sensor is supported by the actuator rotor. A conductive stack is positioned above the spacer ring. A wire electrically connects the sensor to the conductive stack. A plurality of vias extending through the spacer ring and to the electrical distribution substrate, thereby allowing electrical communication between the sensor and the electrical distribution substrate while enabling vertical displacement of the sensor and actuator rotor.