Molded Sensor Packages With Attached Connectors for Parallel Pretesting
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional processes for producing packaged components with large protruding leads limit the number of units that can be assembled from a single lead frame panel and tested simultaneously, making it difficult to accommodate both small and large discrete components effectively.
Innovation Solution
Applying low-cost, high-density packaging techniques to create compact sensors with attached connectors, allowing for pretesting in parallel and direct fusion to metallic pads, enabling easy insertion and removal from sockets.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If conventional processes use lead frames with large protruding leads to create packaged components, then the components can be easily inserted into sockets for testing or replacement, but the number of units that can be assembled from a single lead frame panel is limited
Solution Approach 1:
The patent divides the lead frame structure into two separate components: a compact molded package containing the sensor die and a separate connector assembly with protruding leads. This segmentation allows the molded package to be densely arranged on the lead frame panel while the connector assembly provides the socket insertion capability, thereby increasing the number of units per panel while maintaining ease of operation.
Solution Approach 2:
The patent introduces an intermediary connection structure where the connector assembly acts as a mediator between the compact molded package and the socket. The connector assembly with its protruding leads enables easy socket insertion while the molded package maintains its compact form factor, resolving the contradiction between ease of operation and productivity.
2Ease of repair
If conventional processes use lead frames with large protruding leads, then components can be easily removed for testing or replacement, but it limits the number of components that can be tested simultaneously
Solution Approach 1:
By segmenting the component into a compact molded package and a separate connector assembly, the patent enables dense arrangement of multiple molded packages on a test panel. The connector assemblies can be attached after packaging, allowing high-density parallel testing of multiple units while maintaining ease of removal for individual testing or replacement.
Solution Approach 2:
The patent performs preliminary packaging of sensor dies into compact molded packages before attaching the connector assemblies. This preliminary action enables high-density arrangement of packaged components on test panels, increasing the number of components that can be tested simultaneously while preserving ease of removal through the separate connector assembly.
3Productivity
If compact sensors are packaged without large protruding leads, then high-density packaging is achieved, but the components cannot be easily inserted into sockets or fixtures
Solution Approach 1:
The patent segments the component system into a compact molded package for high-density packaging and a separate connector assembly with protruding leads for socket insertion. This segmentation allows the molded package to achieve high packaging density while the connector assembly provides the necessary interface for easy socket insertion and removal.
Solution Approach 2:
The connector assembly serves as an intermediary between the compact molded package and the socket interface. It enables the compact package to be easily inserted into sockets or fixtures while maintaining the high-density packaging advantage, effectively bridging the gap between compact form factor and ease of operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables high-throughput testing and assembly of electronic devices with a small form factor, comparable to leaded socket assemblies, while reducing resource consumption and cost.
Implementation Method 1
direct fusion to metallic pads
Data Source
Figure 1
Figure 2
Figure 3
AI summary
An electronic device has a molded package (e.g., a quad flat no leads package) with attached connectors. The molded package includes one or more semiconductor dies and is pretested prior to attachment of the connectors. Along these lines, such molded packages may be pretested in parallel at high volume due to their relatively small form factor (e.g., at numbers several times greater than those for testing leaded socket assemblies). Following such pretesting, the connectors are attached to the pretested molded package (e.g., by directly fusing the connectors to metallic pads on surfaces of the packaged integrated circuit via laser welding or soldering). Such electronic devices may be further tested if desired (e.g., opens/shorts tested) and encased within housings to form larger modules (e.g., accelerometers, pressure sensors, etc.).