Micro LED Connection-Tip Transfer for High-Density Displays
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Solution Overview
Problem
Micro LEDs, due to their small size, pose challenges in handling and mounting on display panels, making it difficult to implement high-density pixel arrangements in displaying apparatuses.
Innovation Solution
A displaying apparatus design that includes a panel substrate with light emitting devices featuring connection tips, electrode pads, and a method of transferring these devices using temporary substrates and connection layers to facilitate precise placement and attachment on a base substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If micro LEDs are used to achieve high-density pixel arrangements, then the displaying apparatus can implement higher resolution and better image quality, but the small size of micro LEDs makes them difficult to handle and mount on display panels
Solution Approach 1:
The patent introduces a transfer substrate as an intermediary carrier to grow and hold multiple micro LEDs during fabrication. This transfer substrate acts as a mediator between the micro LED fabrication process and the final display panel assembly, enabling easy handling and precise transfer of micro LEDs without direct manual manipulation of individual tiny components.
Solution Approach 2:
The patent segments the micro LED fabrication and assembly process into distinct stages: growing micro LEDs on a transfer substrate, transferring them to the display panel in groups or arrays, and finally integrating them into the display structure. This segmentation allows each stage to be optimized independently, making the overall process more manageable despite the small size of individual micro LEDs.
2Adaptability or versatility
If a large number of micro LEDs are arranged on one substrate to implement various colors, then the display can achieve full-color capability, but the complexity of arranging and connecting so many small components increases significantly
Solution Approach 1:
The patent merges multiple micro LEDs of different colors (red, green, blue) onto a single transfer substrate in a predetermined pattern. This combining approach allows all necessary color components to be fabricated and positioned together, then transferred as a unified array to the display panel, significantly reducing the complexity of arranging individual components separately.
Solution Approach 2:
The patent performs preliminary arrangement and connection of micro LEDs on the transfer substrate before final installation on the display panel. This preliminary action includes forming connection tips, establishing electrical connections, and positioning micro LEDs in their final relative positions, which simplifies the subsequent integration process and reduces overall assembly complexity.
Data Source
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AI summary
A displaying apparatus including: a panel substrate; a plurality of light emitting devices arranged on the panel substrate; and at least one connection tip disposed on one surface of each of the light emitting devices. Each of the light emitting devices includes a light emitting structure including a first conductivity type semiconductor layer, a second conductivity type semiconductor layer, and an active layer interposed between the first and second conductivity type semiconductor layers; and first and second electrode pads disposed on the light emitting structure.