MEMS Shelf Interconnects for Direct Solder Mounting
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Solution Overview
Problem
MEMS devices face challenges in integrating with various form factors and miniaturized devices, requiring efficient packaging and connection to external components while minimizing space and reducing complexity.
Innovation Solution
A MEMS device design featuring a shelf with electrical connection points and solder couplings that extend beyond the upper surface, allowing direct attachment to external components, eliminating the need for intermediate packaging layers and reducing overall size and fabrication steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional MEMS packaging with intermediate layers is used, then reliable electrical connections are achieved, but device size and weight increase
Solution Approach 1:
The patent removes intermediate packaging layers and structures from the traditional MEMS device architecture. By extracting these unnecessary intermediate components, the device achieves direct electrical connections between the MEMS components and external circuitry, thereby reducing weight while maintaining connection reliability through the optimized shelf and solder coupling design.
Solution Approach 2:
The patent utilizes the shelf structure that extends horizontally from the vertical stack of MEMS layers. This dimensional transition from vertical stacking to horizontal extension allows electrical connection points to be accessible on the shelf surface, enabling direct solder couplings to external components without requiring intermediate vertical packaging layers, thus reducing overall device weight.
2Reliability
If traditional MEMS packaging with intermediate layers is used, then electrical connections are established, but device volume increases
Solution Approach 1:
The patent extracts and eliminates intermediate packaging layers that traditionally occupied significant volume in MEMS devices. By removing these layers and implementing direct connections through the shelf structure, the device volume is reduced while electrical connection reliability is maintained through the optimized connection architecture.
Solution Approach 2:
The patent merges the functions of multiple separate components into the shelf structure. The shelf simultaneously serves as a mechanical support structure, an electrical connection carrier, and a mounting platform for solder couplings. This consolidation eliminates the need for separate intermediate packaging layers, thereby reducing device volume while maintaining connection reliability.
3Volume of stationary object
If shelf with direct solder couplings is used, then device size is reduced, but manufacturing complexity arises
Solution Approach 1:
The patent segments the manufacturing process into distinct stages: forming the shelf structure during MEMS fabrication, adding electrical connection points on the shelf surface, and finally attaching solder couplings. This segmentation allows each step to be optimized independently, making the overall process more manageable despite the novel architecture, thereby reducing device volume while controlling manufacturing complexity.
4Productivity
If intermediate packaging layers are eliminated, then manufacturing steps are reduced, but connection reliability may be compromised
Solution Approach 1:
The patent extracts and removes intermediate packaging layers that added manufacturing steps without providing essential functions. By eliminating these layers and implementing direct solder couplings to the shelf, the number of manufacturing steps is reduced, improving productivity while connection reliability is maintained through the robust shelf and solder coupling design.
Solution Approach 2:
The shelf structure is designed to inherently provide the necessary functions previously requiring intermediate packaging layers. The shelf serves as its own mounting platform and electrical connection carrier, eliminating the need for separate packaging structures. This self-service approach reduces manufacturing steps while maintaining connection reliability through the integrated design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces the size and weight of MEMS devices, enabling them to fit in smaller environments with improved stability and reduced manufacturing costs, while maintaining reliable electrical and mechanical connections.
Implementation Method 1
a plurality of solder couplings, where each of the plurality of solder couplings is bonded to one of the plurality of electrical connection points
Data Source
AI summary
A MEMS device, comprising a plurality of stacked layers, includes a plurality of solder couplings that mechanically fasten and electrically couple the MEMS device to an external component. The plurality of solder couplings is connected atop a portion of an upper surface that extends past an edge surface of a MEMS layer to form a shelf and are electrically connected via the shelf to receive signals generated by the MEMS device. These signals are provided to the external component via the solder couplings.