MEMS Temperature Equalizer for Accurate Chip Thermal Compensation
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Solution Overview
Problem
MEMS components face inaccuracies in temperature corrections due to temperature differences between the MEMS chip and the control circuit, leading to mechanical stress and degradation of measurement accuracy, as existing solutions like thermal glue application cause mechanical stress and inadequate temperature sensing.
Innovation Solution
Implementing a metallic temperature equalizer between the MEMS chip and the control chip within a ceramic housing to equalize their temperatures, utilizing materials with high thermal conductivity like copper, aluminum, gold, steel, or tungsten to ensure thermal equilibrium.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If temperature sensing is implemented in the control circuit, then temperature measurement capability is provided, but the measured temperature does not accurately reflect the MEMS chip temperature due to spatial separation
Solution Approach 1:
A temperature equalizer made of thermally conductive material (such as metal) is introduced as an intermediary between the MEMS chip and the control circuit. This equalizer conducts heat between the two chips, causing their temperatures to equalize, allowing the control circuit to accurately sense the MEMS chip temperature through its own temperature sensor
2Temperature
If thermal glue is used to improve heat dissipation between chips, then thermal coupling is enhanced, but mechanical stress is transferred directly to the chips degrading measurement accuracy
Solution Approach 1:
The patent introduces a temperature equalizer made of thermally conductive material (such as metal) as an intermediary between the MEMS chip and the control circuit. This equalizer provides thermal coupling while isolating the chips from mechanical stress, unlike direct thermal glue application
Solution Approach 2:
The temperature equalizer is positioned specifically between the MEMS chip and control circuit, providing localized thermal management exactly where needed, while leaving the chip mounting surfaces free from mechanical stress of adhesive bonding
3Ease of operation
If temperature corrections are applied based on control circuit temperature, then temperature compensation is provided, but incorrect corrections occur when MEMS chip temperature differs significantly
Solution Approach 1:
The temperature equalizer acts as a thermal mediator that ensures the control circuit and MEMS chip operate at the same temperature, allowing the control circuit to use its temperature sensor to accurately determine the MEMS chip temperature for correct compensation calculations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The temperature equalizer maintains accurate temperature corrections by minimizing temperature differences between the chips, reducing mechanical stress, and enhancing measurement precision.
Implementation Method 1
The MEMS component comprises a metallic temperature equalizer (26) on the mounting surface. The temperature equalizer maintains accurate temperature corrections by minimizing temperature differences between the chips
Data Source
Figure 1~2b
Figure 2c~2e
AI summary
A MEMS component which comprises a MEMS chip, a control chip and a housing which forms an enclosure around the MEMS chip and the control chip. The housing comprises a ceramic chip-holder which forms a mounting surface within the enclosure. The MEMS component comprises a metallic temperature equalizer on the mounting surface. The MEMS chip and the control chip are mounted on the temperature equalizer.