MEMS Cooling Cell Tiles with Vibrational Fluid Drive

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Existing cooling solutions for computing devices, such as fans and passive heat spreaders, are inadequate for both mobile and larger devices, leading to thermal management challenges due to size constraints and inefficiencies in heat dissipation, particularly as computing power increases.

Innovation Solution

A system of integrated cooling cells with a centrally anchored cooling element that undergoes vibrational motion to drive fluid towards heat-generating structures, utilizing piezoelectric actuation for efficient heat transfer, suitable for devices with limited space.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If active cooling devices such as fans are used, then heat dissipation capability is improved, but device size and complexity increase

Engineering Contradiction:

Improveheat dissipation capabilityVSAvoiddevice size

Core Design Contradiction:

TemperatureVSVolume of moving object

Solution Approach 1:

The cooling system is divided into multiple independent cooling cells (e.g., 2x2 array) that can be integrated into the device. Each cell contains a micro-scale cooling element that operates independently, allowing distributed heat dissipation across the device surface without requiring a single large fan assembly.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent replaces traditional mechanical fans with MEMS-based cooling elements that use electrostatic or piezoelectric actuation. These micro-scale elements generate acoustic waves or vibrational motion to drive fluid flow, eliminating the need for large rotating mechanical components while achieving effective heat dissipation.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Volume of moving object

If passive cooling devices such as heat spreaders are used, then device size is reduced, but heat dissipation capability becomes insufficient

Engineering Contradiction:

Improvedevice sizeVSAvoidheat dissipation capability

Core Design Contradiction:

Volume of moving objectVSTemperature

Solution Approach 1:

The cooling system transitions from static passive heat spreaders to dynamic active cooling elements that vibrate or move to drive fluid flow. The MEMS cooling elements are actuated to create periodic motion, dynamically enhancing heat transfer coefficients and enabling superior heat dissipation in a compact form factor.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The patent employs vibrational motion of cooling elements to enhance heat transfer. The MEMS elements are actuated at resonant frequencies to generate acoustic waves that drive fluid circulation and improve convective heat transfer, achieving high heat dissipation capability without increasing device size.

Inventive Principle:

Principle #18Mechanical vibration

3Productivity

If computing power is increased, then processing speed is improved, but heat generation increases

Engineering Contradiction:

Improveprocessing speedVSAvoidheat generation

Core Design Contradiction:

ProductivityVSTemperature

Solution Approach 1:

The cooling system is designed and integrated in advance with the high-power computing components. Multiple cooling cells are strategically positioned to target specific heat-generating regions before thermal problems occur, ensuring that adequate cooling capacity is already in place to support increased processing speeds and power consumption.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The system effectively cools heat-generating structures in devices with limited space by driving fluid at high speeds and reducing backflow, enhancing thermal management and maintaining device performance.

Implementation Method 1

The cooling element has a central region having an axis and a perimeter. The cooling element is supported by the support structure at the central region and along the axis. At least a portion of the perimeter being unpinned. The cooling element is configured to undergo vibrational motion when actuated to drive a fluid toward a heat-generating structure.

Methodology Applied

Scientific EffectVibrational motion: Vibration

Implementation Method 2

utilizing piezoelectric actuation for efficient heat transfer

Methodology Applied

Scientific EffectPiezoelectric actuation: Piezoelectric Effect

Implementation Method 3

The cooling element is configured to undergo vibrational motion when actuated to drive a fluid toward a heat-generating structure

Methodology Applied

Scientific EffectFluid flow: Convection

Implementation Method 4

The system effectively cools heat-generating structures in devices with limited space by driving fluid at high speeds and reducing backflow

Methodology Applied

Scientific EffectFluid flow control: Pressure Gradient

Data Source

PatentUS20250263292A1Tiles having multiple cooling cells for MEMS-based cooling

Publication Date: 2025.08.21 FRORE SYSTEMS INC

AI summary

A system including a plurality of cooling cells is described. Each of the cooling cells includes a support structure and a cooling element. The cooling element has a central region having an axis and a perimeter. The cooling element IS supported by the support structure at the central region and along the axis. At least a portion of the perimeter being unpinned. The cooling element is configured to undergo vibrational motion when actuated to drive a fluid toward a heat-generating structure. A portion of the cooling cells aligned along the axis are physically connected such that the cooling cells form an integrated cooling cell tile.