Pressure Sensor Package Edge Venting for Contamination Resilience
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Solution Overview
Problem
Conventional semiconductor packages for pressure sensors require vents that allow contaminants to enter the central cavity, compromising the function and accuracy of the sensitive semiconductor dies.
Innovation Solution
The formation of vents or channels on the sides of the semiconductor package, either on the lid or body, or both, allows airflow while reducing contamination by positioning them away from the main vent, enhancing resilience to debris and maintaining device functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional vents are used in the package, then airflow to the semiconductor die is enabled, but contaminants can enter the central cavity and compromise device function
Solution Approach 1:
The single vent is segmented into multiple vents distributed around the package perimeter. This segmentation allows airflow to be achieved through multiple smaller pathways rather than one large opening, reducing the likelihood that contaminants will enter and block the entire airflow path to the semiconductor die.
Solution Approach 2:
The vents are positioned at the peripheral edges of the package body in a distributed pattern around the perimeter, rather than concentrating the vent opening near the center where the semiconductor die is located. This spatial distribution in the peripheral dimension creates a more resilient airflow path that is less susceptible to contamination.
2Ease of manufacture
If a single vent is used, then manufacturing is simplified, but the package is vulnerable to contamination blocking the airflow path
Solution Approach 1:
The single vent is divided into multiple smaller vents that can be formed simultaneously using standard molding techniques. While the number of vents increases, they can be created in a single manufacturing step through multi-cavity molds or by forming recesses in the mold cavity, maintaining ease of manufacture while improving airflow resilience.
Solution Approach 2:
The mold cavity is designed with recesses or features that pre-form the multiple vent openings during the packaging process. This preliminary action ensures that the vents are created automatically as part of the standard packaging manufacturing流程, avoiding complex post-processing steps while achieving the segmented vent configuration.
3Productivity
If vents are positioned near the center, then airflow path is short, but contaminants can directly reach the semiconductor die
Solution Approach 1:
The vents are repositioned from the central region to the peripheral edges of the package body, utilizing the dimensional space around the perimeter. This repositioning creates a spatial separation between the contaminant entry points at the edges and the semiconductor die at the center, allowing airflow to bypass the central region where contaminants could directly impact the device.
Solution Approach 2:
The peripheral positioning of vents creates an intermediate airflow path that routes air around the edges of the package body rather than directly through the center. This intermediate path acts as a buffer zone that reduces the direct exposure of the semiconductor die to contaminants entering through the vents.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The side-located vents improve the resilience of the package to contamination, ensuring consistent airflow and reducing damage to the pressure-sensitive gel and semiconductor dies, thereby maintaining the accuracy and reliability of the pressure sensor.
Implementation Method 1
the first channel or the first plurality of channels define a vent or a plurality of vents that exposes a cavity to ambient air pressure
Data Source
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AI summary
A semiconductor device may include a semiconductor die mounted on a substrate. A semiconductor device may include a body portion of a semiconductor package including a plurality of walls configured to define a cavity. A semiconductor device may include a package lid having a plurality of channels formed in a bottom surface of the package lid and the bottom surface of the package lid is mounted to a top surface of the body portion of the semiconductor package. A semiconductor device may include a vent or a plurality of vents that exposes the cavity of the semiconductor package to ambient air and other media exterior the semiconductor package.