Vacuum Adsorption System for OLED Substrate Packaging
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Solution Overview
Problem
Existing vacuum adsorption systems for OLED display devices cause deformation of the mother substrate's packaging areas due to adsorption force, leading to poor packaging and reduced service life due to untightness.
Innovation Solution
A vacuum adsorption system with a carrying platform, detection unit, and adjustment unit to ensure that adsorption units do not overlap with packaging areas, allowing for proper positioning and flat frit surfaces, using a detection unit to assess positional relationships and adjust the platform accordingly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If vacuum adsorption is applied directly to the mother substrate on the vacuum adsorption platform, then the mother substrate can be fixed for packaging, but the packaging areas on the mother substrate will be deformed due to adsorption force
Solution Approach 1:
The vacuum adsorption platform is segmented into multiple independent adsorption holes distributed across the platform surface. This segmentation allows the adsorption force to be distributed across multiple points rather than concentrated in one area, reducing the deformation pressure on any single packaging area while maintaining overall adsorption effectiveness for substrate fixation.
Solution Approach 2:
The adsorption holes are strategically positioned in areas that do not overlap with the packaging areas of the mother substrate. This local quality approach ensures that the packaging areas remain free from direct adsorption force, maintaining their surface flatness and preventing deformation, while other areas of the substrate are still effectively adsorbed for stable positioning.
2Ease of operation
If adsorption holes are used on the vacuum adsorption platform, then adsorption force can be applied, but the packaging areas will be deformed causing large step on printed frit surface
Solution Approach 1:
The positions of the adsorption holes are predetermined and designed in advance to avoid overlapping with the packaging areas of the mother substrate. This preliminary action ensures that when vacuum adsorption is applied, the packaging areas and printed frit surfaces are not directly subjected to adsorption force, thereby maintaining surface flatness while still achieving effective substrate fixation.
3Reliability
If grooves or adsorption holes are provided on the vacuum adsorption platform, then the mother substrate can be adsorbed and fixed, but the packaging areas corresponding to grooves will be deformed
Solution Approach 1:
The adsorption holes are strategically positioned in areas that do not overlap with the packaging areas of the mother substrate. This local quality approach ensures that the packaging areas remain free from direct adsorption force, maintaining their surface flatness and preventing deformation, while other areas of the substrate are still effectively adsorbed for stable positioning.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures a flat surface for printed frit and proper packaging of OLED display devices, preventing gaps and extending the service life by ensuring hermetic sealing between substrates.
Implementation Method 1
adsorbing, by vacuumizing, the mother substrate 20 to be packaged to fix it on the vacuum adsorption platform 10
Data Source
AI summary
Vacuum adsorption system of the invention includes: vacuum adsorption platform; carrying platform, which is provided on vacuum adsorption platform and edges thereof are sealed with edges of vacuum adsorption platform, configured to carrying mother substrate to be packaged and provided thereon with a plurality of adsorption units used for adsorbing and fixing, in cooperation with vacuum adsorption platform, mother substrate to be packaged; detection unit, configured to detect positional relationships between adsorption units on carrying platform and packaging areas on mother substrate to be packaged; and adjustment unit, configured to adjust position of carrying platform when detection unit detects that positions of adsorption units on carrying platform are overlapped with packaging areas on mother substrate to be packaged, so that positions of at least part of adsorption units on carrying platform are not overlapped with packaging areas on mother substrate to be packaged.