LED Package Frame with Conductive Extension Structures for Heat Dissipation
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Solution Overview
Problem
Side View LED packages face challenges in effective heat dissipation due to limited heat dissipation paths, which hinder the performance and efficiency of LED devices while maintaining a low cost.
Innovation Solution
The design incorporates a frame body with conductive extension structures that extend from one side surface to the opposite side surface, encapsulating the light-emitting diode chip and providing enhanced heat dissipation by direct contact with conductive pads, eliminating the need for a substrate and leadframe, thereby increasing the heat dissipation area and reducing the package thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a traditional Side View LED package with leadframe is used, then the package structure is simple and cost-effective, but the heat dissipation path is limited to the outer wire resulting in poor heat dissipation performance
Solution Approach 1:
The patent transitions from a traditional leadframe-based heat dissipation structure to a frame body with conductive extension structures that extend in multiple dimensions. The conductive extension structures extend from the first side surface to the second side surface of the frame body, creating three-dimensional heat dissipation paths that significantly increase the heat dissipation area compared to the limited outer wire path in conventional designs.
Solution Approach 2:
The frame body structure serves multiple functions simultaneously: it provides mechanical support, establishes electrical connections through conductive extension structures, and acts as a heat dissipation pathway. The conductive extension structures integrate electrical connectivity and thermal management functions into a single structural element, eliminating the need for separate leadframes and substrates.
2Temperature
If the heat dissipation area is increased through traditional means, then the heat dissipation performance improves, but the package thickness increases
Solution Approach 1:
Instead of increasing heat dissipation area by expanding the package thickness in one dimension, the patent utilizes the frame body's three-dimensional structure with conductive extension structures that extend between opposite side surfaces. This approach distributes heat dissipation across multiple surfaces and dimensions, achieving large heat dissipation area while maintaining compact package thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively enhances heat dissipation and reduces the temperature at the LED chip junction, improving the performance and efficiency of the LED device while maintaining a cost-effective structure.
Implementation Method 1
The first conductive extension structure and the second conductive extension structure are located in the frame body... providing enhanced heat dissipation by direct contact with conductive pads
Data Source
AI summary
A light-emitting diode (LED) device and a manufacturing method thereof are provided. The LED device includes a frame body, a first conductive extension structure, a second conductive extension structure, and a LED chip. The frame body includes an upper surface, a bottom, a recess on the opposite side of the bottom, and a first side surface and a second side surface opposite to each other. The first and second conductive extension structures are located in the frame body. The first and second conductive extension structures extend from the first side surface to the second side surface of the frame body. The frame body encapsulates a left side surface, a right side surface, a top surface, and a bottom surface of each of the first and second conductive extension structures. The LED chip is disposed in the recess and includes a first conductive pad and a second conductive pad.