Half-In-Cell Array Substrate Sensor Integration
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Solution Overview
Problem
Existing display panel technologies face challenges with sensor arrangement, including crowded sensor configurations in In-Cell structures and increased thickness in Out-Cell structures, which complicate manufacturing and affect temperature sensitivity in OLED displays.
Innovation Solution
The proposed array substrate employs a Half-In-Cell structure, where the sensing thin-film transistor is embedded between the substrate and packaging layer, and the sensing unit is arranged outside, allowing for increased space and reduced thickness, with sensing and display thin-film transistors sharing or having different film layers for simplified manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If sensors are arranged in In-Cell structure, then integration is improved, but sensor configuration becomes crowded and manufacturing complexity increases
Solution Approach 1:
The sensor system is segmented into two parts: the sensing thin-film transistor is placed in the In-Cell region between substrate and packaging layer, while the sensing unit is placed in the Out-Cell region on the packaging layer side. This segmentation allows each component to occupy optimal space, reducing crowding while maintaining integration.
Solution Approach 2:
The patent transitions from a traditional single-plane sensor arrangement to a three-dimensional distributed arrangement across different layers and regions. The sensing transistor is embedded in the internal cell area while the sensing unit extends to the external surface, utilizing vertical and horizontal dimensions to reduce spatial conflict.
2Ease of manufacture
If sensors are arranged in Out-Cell structure, then manufacturing is simplified, but substrate thickness increases
Solution Approach 1:
By dividing the sensor into sensing transistor (inside) and sensing unit (outside), the structure maintains a compact thickness profile while simplifying manufacturing. The sensing unit on the packaging layer side can be processed separately, reducing overall substrate thickness requirements.
3Adaptability or versatility
If sensing and display thin-film transistors use different film layers, then functionality is improved, but manufacturing precision requirements increase
Solution Approach 1:
Different film layer configurations are applied locally based on functional requirements. The sensing transistor region may use oxide semiconductor layers for low leakage current, while display transistor regions use appropriate materials for high mobility. This localized differentiation maintains functionality while managing manufacturing complexity through region-specific optimization.
Data Source
AI summary
An array substrate includes a substrate, a packaging layer, and at least one sensor. The packaging layer is over the substrate. Each sensor includes a sensing thin-film transistor and a sensing unit, electrically coupled with each other. The sensing thin-film transistor is between the package layer and the substrate, and the sensing unit is over a side of the package layer away from the substrate. The array substrate can also include a plurality of display thin-film transistors. The sensing thin-film transistor in each sensor can be at substantially same film layers, or of a same structure and a same type, as each display thin-film transistor.