Hall Element Module Miniaturization via Nested Terminal Geometry
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Solution Overview
Problem
Current Hall element modules are not sufficiently miniaturized, with the arrangement and shapes of the Hall elements and leads not adequately optimized for compactness.
Innovation Solution
A Hall element module design featuring a Hall element with a terminal portion and island portion, both electrically connected and covered by a resin package, where the terminal and island portions have inclined surfaces and thin walls to minimize size and prevent detachment, allowing for a more compact rectangular shape with diagonals along the x and y directions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the Hall element and lead are arranged in a conventional configuration, then the module can be manufactured with standard processes, but the module size cannot be sufficiently miniaturized
Solution Approach 1:
The terminal portion is formed with a nested structure where the lead is folded back and embedded within the resin package, creating a compact nested arrangement that reduces overall module volume while maintaining electrical connectivity functions
Solution Approach 2:
The terminal portion extends in the thickness direction (z-axis) rather than only in the planar directions, utilizing the third dimension to reduce the footprint area and achieve miniaturization of the module
2Volume of moving object
If the terminal portion is made thinner to reduce size, then the module can be miniaturized, but the terminal portion may detach from the resin package
Solution Approach 1:
The terminal portion incorporates inclined surfaces (slanted surfaces) instead of flat surfaces, creating a geometric interlocking structure with the resin package that prevents detachment while allowing the terminal portion to be made thinner
Solution Approach 2:
The resin package is formed as a composite structure that encapsulates and bonds to the terminal portion, creating a integrated assembly where the resin provides both structural support and mechanical anchoring for the thinner terminal portion
Data Source
AI summary
The present invention provides a Hall element module for achieving miniaturization. A Hall element module includes a Hall element having an element surface and an element back surface, a terminal portion electrically connected to the Hall element and separated from the Hall element as viewed in a z direction, and a resin package covering at least one portion of each of the Hall element and the terminal. The resin package has a rectangular shape with four sides along the x direction and the y direction as viewed in the z direction. The terminal portion includes a terminal back surface facing the z direction and exposed from the resin package. An end edge of the terminal back surface includes a terminal back surface inclined portion opposed to the Hall element and inclined with respect to the x direction and the y direction as viewed in the z direction.