Hall Element Terminal Segmentation for Low Profile Mounting
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Solution Overview
Problem
Existing semiconductor devices face challenges in achieving a low profile and reliable mounting structure for Hall elements in electronic devices, particularly in mobile phones, due to issues with thermal shock and electrical connectivity.
Innovation Solution
A semiconductor device design featuring a Hall element with a specific terminal configuration and sealing resin structure, where the terminals have a base part and projecting part with conductive layers, and a sealing resin that covers the element, allowing for efficient electrical connection and thermal management, and a conductive joining layer for mounting on a wiring board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the semiconductor device uses a conventional terminal configuration, then the device structure is simple, but the profile height is large and mounting reliability is poor
Solution Approach 1:
The terminal is divided into three distinct parts: a base part embedded in the sealing resin, a bridge part connecting the base to the projecting part, and a projecting part extending toward the wiring board. This segmentation allows each part to serve specific functions - the base part provides stable embedding, the bridge part provides mechanical support and electrical connection, and the projecting part enables soldering to the wiring board, thereby achieving low profile height while maintaining structural complexity for reliability
Solution Approach 2:
The terminal structure transitions from a conventional two-dimensional planar arrangement to a three-dimensional configuration with vertical extension. The base part is embedded in the sealing resin at a first level, while the projecting part extends upward to a second level closer to the wiring board, creating a stepped vertical arrangement that reduces the overall profile height while maintaining electrical connectivity
2Temperature
If the semiconductor device uses a conventional sealing structure, then the manufacturing process is simple, but thermal dissipation is poor and thermal shock resistance is low
Solution Approach 1:
The bridge part of the terminal serves as an intermediary thermal conduction path between the semiconductor element and the wiring board. It has a thermal conductivity of 3.0 W/m·K or higher, which is greater than the sealing resin's thermal conductivity, enabling efficient heat transfer from the element through the terminal structure to the wiring board, thereby improving thermal dissipation while the sealing resin provides mechanical protection
3Reliability
If the terminal is positioned close to the semiconductor element, then electrical connectivity is good, but the device profile height increases
Solution Approach 1:
The terminal is segmented into a base part embedded in the sealing resin and a projecting part extending toward the wiring board, with a bridge part connecting them. This segmentation allows the base part to be positioned close to the semiconductor element for good electrical connectivity, while the projecting part extends vertically to reduce the overall profile height and enable proper mounting on the wiring board
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves a lower profile, improved thermal dissipation, and enhanced electrical connectivity, reducing the risk of thermal shock and increasing the detection accuracy of magnetic flux density changes.
Implementation Method 1
The conductive joining layer joins the semiconductor device to the wiring board
Implementation Method 2
improved thermal dissipation
Implementation Method 3
Semiconductor devices in which semiconductor elements are Hall elements
Data Source
AI summary
The present disclosure provides a semiconductor device. The semiconductor device includes a semiconductor element, a plurality of terminals, and a sealing resin. The semiconductor element has a front surface and a back surface. The front surface and the back surface face in opposite directions to each other in a thickness direction of the semiconductor element. The plurality of terminals are disposed at a distance from the semiconductor element and are electrically connected to the front surface. The sealing resin has a first surface facing in a same direction as the direction in which the front surface faces. Each of the plurality of terminals has a main surface exposed from the first surface.