Halogen-Containing Amorphous Oxide Packaging for OLED Stress Reduction

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Current OLED device packaging faces issues with internal stress, defects, and increased manufacturing costs due to the use of multiple inorganic layers, which can lead to device failure from water vapor and oxygen ingress.

Innovation Solution

A packaging structure incorporating a halogen-containing amorphous solid oxide thin film with a crosslinked-polyhedra-network structure, combined with an inorganic layer, to provide a dense and hydrophobic barrier that effectively blocks external water vapor and oxygen, reducing the need for multiple layers and simplifying the fabrication process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If multiple thin-film inorganic layers are used for packaging, then the barrier performance against water vapor and oxygen is improved, but the internal stress increases and reliability decreases

Engineering Contradiction:
Improvepackaging reliabilityVSAvoidinternal stress
Core Design Contradiction:
ReliabilityVSStress or pressure

Solution Approach 1:

The patent changes the material parameter from conventional inorganic materials to halogen-containing amorphous solid oxide, which fundamentally alters the stress characteristics while maintaining barrier performance. This material substitution reduces internal stress in the packaging structure.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent employs composite material structure by combining halogen-containing amorphous solid oxide with specific inorganic layers, creating a multi-layer composite packaging structure that achieves both low stress and high barrier performance through synergistic material properties.

Inventive Principle:
Principle #40Composite materials

2Stress or pressure

If multiple alternating organic and inorganic layers are used, then the stress in each layer is reduced, but the manufacturing cost increases and fabrication process becomes more complicated

Engineering Contradiction:
Improvelayer stressVSAvoidfabrication process complexity
Core Design Contradiction:
Stress or pressureVSDevice complexity

Solution Approach 1:

The patent extracts and eliminates the organic layers from the traditional alternating organic-inorganic multi-layer structure, retaining only the inorganic/halogen-containing oxide layers. This simplification maintains stress reduction benefits while significantly reducing fabrication complexity.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent merges the functions of multiple layers into a simplified structure where halogen-containing amorphous solid oxide layers provide both barrier and stress-management functions that were previously distributed across multiple organic and inorganic layers.

Inventive Principle:
Principle #5Merging (Combining)

3Reliability

If multiple thin-film inorganic layers are deposited, then the barrier performance is improved, but defects such as cracks and impurities are inevitably introduced

Engineering Contradiction:
Improvepackaging barrier performanceVSAvoidfilm quality
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent changes the deposition parameters and material composition to halogen-containing amorphous solid oxide, which forms denser films with fewer defects during deposition. This material parameter change inherently reduces cracks and impurities while maintaining barrier performance.

Inventive Principle:
Principle #35Parameter changes

4Ease of manufacture

If a single inorganic layer is used for packaging, then the fabrication process is simplified, but the barrier performance against water vapor and oxygen is insufficient

Engineering Contradiction:
Improvefabrication simplicityVSAvoidwater vapor and oxygen barrier
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent uses composite material composition within the inorganic layers, incorporating halogen-containing amorphous solid oxide with specific inorganic materials to create a multi-component structure that achieves superior barrier performance in fewer layers.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent optimizes the thickness, composition, and structural parameters of the halogen-containing oxide layers to achieve maximum barrier performance with minimal layer count, simplifying fabrication while maintaining reliability.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The proposed solution significantly enhances the reliability and longevity of OLED devices by creating a robust, defect-free barrier that prevents water vapor and oxygen ingress, thereby improving the durability and reducing manufacturing costs.

Implementation Method 1

the amorphous solid oxide thin film in the at least one passivation layer has a crosslinked-polyhedra-network structure

Methodology Applied
Scientific EffectCrosslinked-polyhedra-network structure:

Implementation Method 2

the device may be isolated from external water vapor and oxygen

Methodology Applied
Scientific EffectPermeation barrier: Permeation

Data Source

PatentUS10446792B2Packaging structure, display device, and fabrication method thereof
Publication Date: 2019.10.15 WUHAN TIANMA MICRO ELECTRONICS CO LTD
  • US10446792B2 patent drawing
  • US10446792B2 patent drawing
  • US10446792B2 patent drawing

AI summary

A packaging structure includes at least one inorganic layer and at least one passivation layer. The at least one passivation layer includes a halogen-containing amorphous solid oxide thin film. The amorphous solid oxide thin film in the at least one passivation layer has a crosslinked-polyhedra-network structure. A display device includes a substrate, a display layer, and a packaging structure. The packaging structure further includes at least one inorganic layer and at least one passivation layer. The at least one passivation layer includes a halogen-containing amorphous solid oxide thin film. The amorphous solid oxide thin film in the at least one passivation layer has a crosslinked-polyhedra-network structure. A method for fabricating a display device includes providing a substrate, forming a display layer over the substrate, and forming a packaging structure over the display layer with the packaging structure including at least one inorganic layer and at least one passivation layer.