Hard Copy Semiconductor Device Using Resistance Variable Via Plugs
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Solution Overview
Problem
The high cost and testing requirements of Field-Programmable Gate Arrays (FPGAs) and Application-Specific Integrated Circuits (ASICs) make it challenging to produce a low-cost, low-power chip for applications requiring several thousand to several ten thousand units, as FPGAs need individual programming and ASICs have high initial investment costs.
Innovation Solution
A semiconductor device and method for manufacturing a hard copy of a reconfigurable circuit using a resistance variable element, where the device includes a semiconductor substrate with a circuit configuration similar to the reconfigurable circuit but without a programming mechanism, and fabricates a low-resistance-state resistance variable element as a via plug, allowing for cost-effective production and reduced power consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If FPGAs are used for reconfigurable circuits, then adaptability is improved, but device complexity and cost increase due to programming mechanisms
Solution Approach 1:
The patent extracts and removes the programming mechanism from the FPGA structure to create a hard copy version. The resistance variable element is retained for its switching function, but the complex programming control circuitry is eliminated, simplifying the device while maintaining adaptability through fixed configuration
Solution Approach 2:
Instead of programming resistance variable elements individually after manufacturing (as in conventional FPGAs), the patent inverts the approach by pre-configuring the resistance variable elements during the manufacturing process itself. This creates a hard copy that is factory-programmed, eliminating the need for post-manufacturing programming mechanisms
2Ease of manufacture
If ASICs are used for hard copy, then cost is reduced by eliminating programming, but initial investment cost increases
Solution Approach 1:
The patent changes the manufacturing parameter by using standard FPGA manufacturing processes and resistance variable element structures, rather than requiring new ASIC fabrication processes. This allows leveraging existing manufacturing infrastructure and tooling, reducing initial investment while achieving hard copy cost benefits
Solution Approach 2:
The patent creates a universal hard copy structure that can be derived from the same base design as FPGAs, allowing the same manufacturing facility to produce both reconfigurable and hard copy versions. This multi-functionality reduces the need for separate manufacturing lines and tooling investments
3Adaptability or versatility
If resistance variable elements are programmed individually, then adaptability is achieved, but productivity decreases
Solution Approach 1:
The patent applies preliminary action by pre-configuring all resistance variable elements during the manufacturing process before the chips are shipped to customers. The desired circuit configuration is established in advance through controlled formation of metal crosslinks, eliminating the need for time-consuming individual programming of each chip after manufacture
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the production of low-cost, low-power reconfigurable circuits by eliminating the need for individual programming and reducing chip costs, while maintaining accurate arithmetic processing capabilities.
Implementation Method 1
a switching element using metal ion translocation and electrochemical reaction in an ion conductor
Implementation Method 2
metal ion translocation and electrochemical reaction in an ion conductor
Implementation Method 3
When the first electrode is grounded and negative voltage is applied to the second electrode, a metal of the first electrode becomes a metal ion and dissolves in the ion conductive layer
Implementation Method 4
The metal ion in the ion conductive layer then precipitates as being a metal in the ion conductive layer
Data Source
AI summary
Provided are a semiconductor device and a method of manufacturing the semiconductor device which enable a hard copy of a reconfigurable circuit, which employs a resistance variable element, to be formed at low cost. The method of manufacturing a semiconductor device is for manufacturing a hard copy from a reconfigurable circuit chip that employs a resistance-variable non-volatile element formed inside a multi-layered wiring layer on a semiconductor substrate, wherein the hard copy is manufactured by using a semiconductor substrate base that is the same as that of the semiconductor substrate for forming the reconfigurable circuit chip.