HBM Cooling via Lateral Heat Pipe to Secondary Sink
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
High Bandwidth Memory (HBM) embedded in Application Specific Integrated Circuits (ASICs) requires more aggressive cooling due to higher heat flux and lower allowable junction temperature compared to ASICs, which existing cooling systems fail to address effectively, especially with limited air intake capacity and preheated airflow.
Innovation Solution
A cooling system incorporating an integrated micro heat pipe/vapor chamber and a miniature heat sink that provides a secondary cooling path for HBM by diverting thermal energy from HBM to a secondary heat sink, without increasing the assembly footprint, using a heat pipe that overlaps with HBM and transfers heat laterally to a secondary heat sink for dissipation via forced convection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a single primary heat sink is used for both ASIC and HBM, then the assembly footprint is minimized, but the HBM cannot be cooled effectively due to shared thermal path and preheated airflow
Solution Approach 1:
The cooling system is segmented into two independent paths: a primary heat sink for ASIC cooling and a secondary heat sink for HBM cooling. This segmentation allows each component to have dedicated thermal management, resolving the contradiction by preventing thermal interference while maintaining compact footprint through vertical integration of the secondary heat sink beneath the primary one.
Solution Approach 2:
The secondary heat sink is positioned in the vertical dimension beneath the primary heat sink, utilizing the Z-axis rather than expanding the horizontal footprint. This dimensional transition allows additional cooling capacity for HBM without increasing the overall assembly area, as the secondary heat sink operates in an otherwise underutilized spatial dimension.
2Ease of manufacture
If the same conduction path through package lid is used for both HBM and ASIC, then manufacturing is simplified, but the HBM experiences higher heat flux and hot spots due to smaller form factor
Solution Approach 1:
The thermal conduction paths are segmented into separate routes: ASIC heat flows through the package lid to the primary heat sink, while HBM heat is diverted laterally through heat pipes to the secondary heat sink. This path segmentation resolves the contradiction by providing dedicated thermal management for HBM's high heat flux while maintaining manufacturing simplicity through modular heat pipe integration.
Solution Approach 2:
The HBM thermal management is extracted from the shared conduction path and implemented as a separate cooling subsystem. Heat pipes are used to extract heat laterally from the HBM and transport it to the secondary heat sink, isolating the HBM thermal path from the ASIC's conduction path through the package lid.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces the maximum temperature of HBM by approximately 4°C, while maintaining efficient cooling of the ASIC, by creating a distinct thermal energy path that alleviates the thermal load on the primary heat sink and enhances cooling capacity without increasing the overall footprint.
Implementation Method 1
one or more heat pipes, wherein the one or more heat pipes at least partially diverts the thermal energy from the high bandwidth memory to the second heat sink
Implementation Method 2
at least one of the heat pipes is a vapor chamber
Implementation Method 3
dissipate the transmitted heat in the form of forced convection
Data Source
AI summary
The subject disclosure relates to an integrated circuit package having an application specific integrated circuit, a high bandwidth memory, a first heat sink having a first footprint and a first path, and a second heat sink having a second footprint and a second path, wherein the second footprint does not exceed the first footprint. The thermal energy through the first path travels from the application specific integrated circuit to the first heat sink and thermal energy through the second path travel from the high bandwidth memory through one or more heat pipes to the second heat sink.