HBM Test Handler With Thermal Shuttle and Vision Alignment
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Solution Overview
Problem
Existing test handlers struggle to efficiently perform electrical inspection processes on high bandwidth memory (HBM) devices after individualization through the dicing process, necessitating improved inspection apparatuses for semiconductor packages.
Innovation Solution
A test handler system comprising a loader unit, tester unit, and shuttle unit, with integrated gripper, load and unload picker units, and vision inspection systems, capable of preheating or cooling semiconductor packages during transfer, and precise alignment and testing to classify HBM devices as good or defective.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a test handler is used to perform electrical inspection on semiconductor packages, then inspection capability is provided, but the system complexity increases due to multiple units (loader, tester, shuttle) and integrated functions
Solution Approach 1:
The patent combines the loader unit, tester unit, and shuttle unit into a single integrated test handler system. The loader unit includes multiple picker units (load picker, unload picker) and a gripper unit that work together within one system. The shuttle unit integrates transfer and thermal control functions. This merging provides complete inspection capability while managing system complexity through integrated design.
Solution Approach 2:
The test handler is designed as a universal system that can handle multiple semiconductor packages simultaneously. The loader unit can load packages from cassettes, the shuttle unit can transfer packages between units while providing preheating or cooling, and the tester unit can perform electrical inspections. This multi-functionality allows the single system to perform complete inspection workflows.
2Ease of operation
If the ring frame expander expands the dicing tape to increase spacing between semiconductor packages, then ease of picking up packages is improved, but the device complexity increases
Solution Approach 1:
The ring frame expander performs preliminary action by expanding the dicing tape and increasing spacing between semiconductor packages before the picker units need to pick them up. This preliminary expansion makes the packages easier to access and pick up by the load picker and unload picker units, improving ease of operation without requiring complex picking mechanisms.
3Measurement precision
If the shuttle unit preheats or cools semiconductor packages during transfer, then test accuracy is improved by compensating for thermal deformation, but energy consumption increases
Solution Approach 1:
The shuttle unit changes the temperature parameter of semiconductor packages during transfer by providing preheating or cooling. This temperature control compensates for thermal deformation that would otherwise occur during the transfer process, improving test accuracy. The system adjusts temperature parameters to match requirements for accurate electrical inspection.
4Manufacturing precision
If vision inspection units are integrated to correct pickup errors, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The vision inspection units provide feedback on the position and orientation of semiconductor packages during handling. This feedback allows the system to detect and correct pickup errors made by the picker units. The vision systems monitor package positions and provide real-time information that enables correction of any positioning errors, improving manufacturing precision through closed-loop control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise electrical inspection and classification of HBM devices, improving test accuracy by correcting pickup errors and compensating for thermal deformation, thereby enhancing the overall inspection process efficiency.
Implementation Method 1
a shuttle unit installed to connect the loader unit and the tester unit, to transfer the semiconductor package to the tester unit or to the loader unit, and to preheat or cool the semiconductor package during transfer
Implementation Method 2
a heater unit installed inside the shuttle stage, to heat the semiconductor package placed on the upper surface of the shuttle stage
Implementation Method 3
a cooling unit including a nozzle installed on a side of the shuttle stage, to spray air toward the semiconductor package placed on the upper surface of the shuttle stage to cool the semiconductor package
Data Source
AI summary
The present disclosure relates to a test handler and a method for testing semiconductor packages using the test handler capable of performing an electrical inspection process on semiconductor packages. The disclosure may include a loader unit to detach a semiconductor package to be tested from a first ring frame on which semiconductor packages to be tested are placed, or to attach a tested semiconductor package to a second ring frame; a tester unit to test the semiconductor package loaded from the loader unit and to unload the tested semiconductor package back to the loader unit; and a shuttle unit installed to connect the loader unit and the tester unit, to transfer the semiconductor package to the tester unit or to the loader unit, and to preheat or cool the semiconductor package during transfer.