Heat-Conductive Package Structure for Semiconductor Thermal Management
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Solution Overview
Problem
Conventional semiconductor package structures are ineffective in dissipating heat generated by semiconductor chips, leading to overheating and reduced performance and lifespan of the components.
Innovation Solution
A heat-conductive package structure is designed with a carrier board featuring heat-conductive sheets and holes that connect through openings, allowing for efficient heat dissipation via heat-dissipating elements like solder balls or metal pins, which connect the semiconductor component to the circuit board, enabling effective heat transfer outside the package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional insulating protective layers are used to mount semiconductor components, then electrical insulation is achieved, but heat dissipation capability deteriorates
Solution Approach 1:
The patent divides the protective layer into multiple segments: an insulating protective layer for electrical insulation and a heat-conductive protective layer for heat dissipation. This segmentation allows each layer to perform its specialized function without compromising the other, resolving the contradiction between insulation and heat dissipation.
Solution Approach 2:
The patent creates a multi-functional protective structure where the insulating protective layer provides both electrical insulation and partial mechanical protection, while the heat-conductive protective layer simultaneously provides heat dissipation and additional mechanical protection. This multi-functionality approach allows the system to achieve multiple contradictory requirements through a unified structure.
2Reliability
If semiconductor chips are mounted on conventional circuit boards, then electrical connections are established, but heat accumulation increases leading to performance deterioration
Solution Approach 1:
The patent introduces a heat-conductive protective layer as an intermediary between the semiconductor chip and the environment. This intermediary layer specifically addresses heat accumulation by providing a dedicated heat dissipation pathway, thereby protecting the semiconductor performance while maintaining electrical connections through the insulating layer.
3Strength
If insulating protective layers contact semiconductor component inactive surfaces, then mechanical support is provided, but heat dissipation is blocked
Solution Approach 1:
The patent segments the protective function into two distinct layers: the insulating protective layer contacts the semiconductor component to provide mechanical support and electrical insulation, while the heat-conductive protective layer is positioned to contact the insulating layer and provide heat dissipation pathways. This segmentation resolves the contradiction by assigning mechanical support to the insulating layer and heat dissipation to the heat-conductive layer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The heat-conductive package structure enhances heat dissipation, prevents overheating, and prolongs the lifespan of semiconductor components and circuit boards while improving electrical performance.
Implementation Method 1
a first heat-conductive structure having a heat-conductive hole in the through opening, a first heat-conductive sheet on the first surface of the carrier board, and a second heat-conductive sheet on the second surface of the carrier board, wherein the first and second heat-conductive sheets are conductively connected by the heat-conductive hole
Data Source
AI summary
A heat-conductive package structure includes a carrier board having a first surface and an opposing second surface and formed with a through opening passing the carrier board; a first heat-conductive structure including a heat-conductive hole in the through opening, a first heat-conductive sheet on the carrier board, and a second heat-conductive sheet on the carrier board, wherein the first and second heat-conductive sheets are conductively connected by the heat-conductive hole; a first dielectric layer formed on the first surface of the carrier board and formed with a first opening for exposing the first heat-conductive sheet; a second dielectric layer formed on the second surface of the carrier board and formed with at least a second opening for exposing a portion of the second heat-conductive sheet; and a second heat-conductive structure formed in the second opening and mounted on the second heat-conductive sheet.