Heat-Dissipating Unit Pin Insertion Method
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Solution Overview
Problem
The existing method for producing heat-dissipating units is labor-intensive and costly, making it difficult to produce them simply and economically, particularly due to the complexity of press-fitting multiple pins with protrusions into substrate through-holes.
Innovation Solution
A method involving the simultaneous punching and insertion of pins into substrate through-holes, where the pins are punched out from a second plate member and inserted into a first plate member with pre-formed holes, allowing for efficient production and alignment of pins and holes, and subsequent cutting to form the substrate, using a die with orthogonal feeding of both plate members.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If pins with protrusions are press-fitted into substrate through-holes, then the pins are fixed to the substrate, but the work of producing the pin becomes troublesome and the cost increases
Solution Approach 1:
The protrusions are extracted from the pin and transferred to separate insertion pieces. This allows the pin to be a simple cylindrical shape that is easy to manufacture, while the insertion pieces provide the fixing function through their protrusions that engage with the through-holes in the substrate.
Solution Approach 2:
The fixing structure is segmented into three components: the pin, the insertion piece with protrusions, and the substrate with through-holes. The insertion piece acts as an intermediary that connects the pin to the substrate, separating the functions of heat conduction (pin) and fixing (insertion piece with protrusions).
2Reliability
If multiple pins with protrusions are press-fitted into through-holes, then the pins are fixed to the substrate, but it becomes troublesome to press-fit the pins
Solution Approach 1:
The insertion pieces are designed to be inserted into the through-holes in a self-aligning manner. The protrusions on the insertion pieces naturally engage with the through-holes, allowing for easy assembly without complex press-fitting operations. Multiple insertion pieces can be installed simultaneously or sequentially with simple insertion motions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies and cost-reduces the production of heat-dissipating units, enhances heat conductivity and load resistance, improves heat transfer performance, and eliminates the need for separate brazing materials, enabling continuous and efficient production of heat radiators with improved pressure resistance.
Implementation Method 1
The pin is press-fitted into the through-hole of the substrate to thereby plastically deform at least the protrusion of the pin among the protrusion of the pin and the peripheral portion of the through-hole of the substrate to fix the pin to the substrate
Data Source
AI summary
[Purpose] To provide is a method capable of producing a heat-dissipating unit easily and at low cost.[Solution] The method of producing a heat-dissipating unit 12 includes: inserting pins 17 punched out of a second plate member 22 for pins into a plurality of through-holes 16 formed in a first plate member 20 for a substrate. In the first plate member 20, a plurality of substrate forming portions 25 is provided side by side in the longitudinal direction of the first plate member 20. In the second plate member 22, a plurality of pin punch-out portions 26 is provided side by side in the longitudinal direction of the second plate member 22. The method includes: a step A of forming the through-holes 16 in the substrate forming portion 25 of the first plate member 20; a step B of subjecting the pin punch-out portion 26 of the second plate member 22 to a half-punch out process to form half-punched-out pin forming portions 27 protruding from one surface side of the second plate member 22; a step C of forming the pins 17 by punching out the pin forming portions 27 from the second plate member 22 and simultaneously inserting the pins 17 into the through-holes 16 in the first plate member 20; and a step D of forming a substrate by cutting the substrate forming portion 25 with the pins 17 inserted in the through-holes 16 from the first plate member 20.