Heat Dissipation Device With Electromagnetic Pumps
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional heat dissipation devices in electronic devices face limitations due to reliance on gravity for medium return, leading to poor heat transfer efficiency and saturation, which restricts the performance of electronic devices as they become smaller.
Innovation Solution
Incorporating at least two pumps within a closed chamber of a heat dissipation device to drive the heat dissipation medium in loops, enhancing flow speed and heat exchange efficiency by creating complex flow directions and increasing contact area with the heat generator.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If gravity-based heat pipe is used, then device structure is simple, but heat dissipation efficiency is poor and heat transfer becomes saturated
Solution Approach 1:
The patent replaces the gravity-based mechanical return system with an electromagnetic pump-driven fluid circulation system. The electromagnetic pump actively propels the heat dissipation medium through the heat pipe, eliminating dependence on gravitational force and enabling controlled bidirectional flow that significantly enhances heat transfer efficiency while maintaining structural simplicity.
Solution Approach 2:
The patent changes the flow dynamics parameter from passive gravity-driven flow to active pump-driven flow. This parameter change enables the heat dissipation medium to circulate continuously in both directions, increasing the heat transfer rate and preventing saturation, thereby resolving the contradiction between structural simplicity and heat dissipation efficiency.
2Volume of moving object
If electronic device size is reduced, then device compactness is improved, but heat dissipation capacity becomes insufficient
Solution Approach 1:
The patent applies hydraulic principles by using a liquid heat dissipation medium circulated through a closed-loop heat pipe system. The electromagnetic pump drives the liquid medium to flow continuously, maximizing heat transfer capacity within the constrained volume of compact electronic devices, thus resolving the contradiction between device miniaturization and heat dissipation capacity.
Solution Approach 2:
The patent implements continuous circulation of the heat dissipation medium through the electromagnetic pump-driven system. This continuous action ensures sustained heat transfer capability in compact devices, preventing the heat transfer saturation that occurs in conventional gravity-based systems and maintaining high heat dissipation capacity despite reduced device size.
3Productivity
If heat transfer by liquid is used, then heat dissipation capacity is high, but heat transfer easily becomes saturated
Solution Approach 1:
The patent implements periodic bidirectional flow of the heat dissipation medium through the electromagnetic pump. The medium alternates flow direction between evaporation and condensation sections, continuously renewing the heat transfer interface and preventing saturation. This periodic action maintains high heat dissipation capacity while ensuring stable, reliable heat transfer over extended operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly improves heat dissipation efficiency, allowing electronic devices to dissipate heat more effectively and maintain processing performance, even in compact designs.
Implementation Method 1
at least two electromagnetic pumps in the closed chamber to drive heat dissipation medium contained in the closed chamber to flow in one or more loops
Implementation Method 2
heat dissipation medium contained in the closed chamber to flow in one or more loops
Implementation Method 3
at least two pumps in the closed chamber to drive heat dissipation medium contained in the closed chamber to flow in one or more loops
Data Source
AI summary
A heat dissipation device and an electronic device thereof are provided. The heat dissipation device includes a heat dissipation body including a closed chamber; and at least two pumps in the closed chamber to drive heat dissipation medium contained in the closed chamber to flow in one or more loops.