Heat Dissipation Gaps in Refractory Bricks for Channel Cooling

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Solution Overview

Problem

Current heat dissipation structures for substrate glass manufacturing face challenges in increasing cooling efficiency while maintaining thermal shock resistance and preventing excessive temperature fluctuations, especially in large-scale applications with limited space.

Innovation Solution

A heat dissipation device for channel cooling sections comprising refractory bricks with heat dissipation gaps and installed heat sinks, allowing for flexible and controlled heat dissipation without altering the internal structure, enhancing cooling efficiency and accommodating varying lead-out volumes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the thickness of external insulation brick is reduced to increase heat dissipation capacity, then cooling efficiency is improved, but the structural strength and thermal shock resistance are compromised

Engineering Contradiction:
Improvecooling efficiencyVSAvoidstructural strength
Core Design Contradiction:
ProductivityVSStrength

Solution Approach 1:

The external insulation brick is segmented into multiple thin brick layers (e.g., 3-5 layers of 8mm bricks) with heat dissipation gaps between them, allowing heat to be dissipated through the gaps while maintaining structural integrity through the layered configuration

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Heat dissipation gaps are strategically positioned at specific locations where heat accumulation is most problematic, creating localized heat dissipation channels without compromising the overall structural strength of the insulation system

Inventive Principle:
Principle #3Local quality

2Productivity

If the cooling section length is increased to improve heat dissipation capacity, then cooling efficiency is improved, but manufacturing complexity and installation difficulty increase

Engineering Contradiction:
Improveheat dissipation capacityVSAvoidmanufacturing complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The cooling section is divided into multiple modular units that can be manufactured separately and then assembled together, reducing manufacturing complexity while achieving the required total length and heat dissipation capacity

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Instead of increasing length in one dimension, the solution adds heat dissipation gaps in the thickness direction of the insulation brick, providing additional heat dissipation pathways without extending the cooling section length

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Productivity

If localized rapid cooling is applied to increase cooling capacity, then cooling efficiency is improved, but thermal shock resistance requirements increase excessively

Engineering Contradiction:
Improvecooling capacityVSAvoidthermal shock
Core Design Contradiction:
ProductivityVSObject-affected harmful factors

Solution Approach 1:

Multiple small heat dissipation gaps are distributed throughout the insulation brick, creating numerous localized heat dissipation points that collectively provide uniform cooling across the glass surface, avoiding concentrated thermal shock

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The heat dissipation gaps provide slightly more cooling capacity than the minimum required, allowing for flexible adjustment and ensuring adequate cooling without creating excessive thermal gradients that would cause thermal shock

Inventive Principle:
Principle #16Partial or excessive action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively increases heat dissipation capacity, improves cooling efficiency, and allows for large-area use by optimizing heat sink placement and distribution within the existing brick structure, reducing thermal shock requirements and preventing localized rapid cooling effects.

Implementation Method 1

at least one heat sink may be installed in one or more of the plurality of heat dissipation gaps

Methodology Applied
Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 2

The first side refractory brick, the second side refractory brick, and the top refractory brick may be arranged with a plurality of heat dissipation gaps

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentUS20250093111A1Heat dissipation devices for channel cooling section and application methods thereof
Publication Date: 2025.03.20 IRICO DISPLAY DEVICES CO LTD
  • US20250093111A1 patent drawing
  • US20250093111A1 patent drawing
  • US20250093111A1 patent drawing

AI summary

The present disclosure provides an embodiment of a heat dissipation device for a channel cooling section and an application method, belonging to a field of substrate glass manufacturing technology. The device includes a side refractory brick, a top refractory brick, a bottom supporting refractory brick, and at least one heat sink. The side refractory brick includes a first side refractory brick and a second side refractory brick. The first side refractory brick and the second side refractory brick are arranged opposite to each other. The top refractory brick is spliced above the first side refractory brick and the second side refractory brick, while the bottom supporting refractory brick is spliced below the first side refractory brick and the second side refractory brick. A cavity structure is formed after the splicing is completed. The first side refractory brick, the second side refractory brick, and the top refractory brick are arranged with a plurality of heat dissipation gaps, and at least one of these gaps is installed with the at least one heat sink. The present disclosure can effectively enhance the heat dissipation efficiency of the channel cooling section and is flexible, controllable, and can be used on a large scale.