Heat Dissipation Module with Segmented Fin Pitch for Safety

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Solution Overview

Problem

Conventional heat dissipation modules in electronic devices face challenges in achieving effective heat dissipation while meeting safety certification requirements, as the limited airflow channel size and fin pitch restrict heat dissipation performance and allow foreign objects to enter.

Innovation Solution

The heat dissipation module incorporates a heat pipe, stacked fins with adjustable pitches, and a fan, where the fins form flow inlets and outlets with bent portions having pitches less than 1 mm to comply with safety certifications, allowing smooth airflow and preventing foreign object entry.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the fin pitch is reduced to less than 1 mm to meet safety certification requirements, then foreign object protection is improved, but heat dissipation performance deteriorates due to restricted airflow

Engineering Contradiction:
Improveforeign object protectionVSAvoidheat dissipation performance
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The heat dissipation module divides the fin structure into multiple segments with different pitch characteristics. The first fin portion has a pitch greater than 1 mm for optimal heat dissipation, while the second fin portion has a pitch less than 1 mm for safety certification compliance. This segmentation allows each portion to fulfill its specific function without compromising the other.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the fin structure are assigned different pitch values based on their functional requirements. The first fin portion (heat dissipation region) maintains a larger pitch for airflow efficiency, while the second fin portion (safety region) uses a smaller pitch for foreign object protection. This local differentiation resolves the contradiction between heat dissipation performance and safety requirements.

Inventive Principle:
Principle #3Local quality

2Productivity

If the flow channel size is increased to improve heat dissipation, then heat dissipation performance is improved, but safety certification requirements are violated due to larger openings allowing foreign object entry

Engineering Contradiction:
Improveheat dissipation performanceVSAvoidsafety certification compliance
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The flow channel is segmented into two functional zones: an inlet region with larger dimensions for effective heat dissipation, and an outlet region with restricted pitch less than 1 mm for safety compliance. This segmentation allows the system to achieve both heat dissipation efficiency and safety certification requirements simultaneously.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different sections of the heat dissipation module are designed with different dimensional characteristics. The inlet area maintains larger flow channel dimensions for heat dissipation effectiveness, while the outlet area implements restricted pitch for foreign object protection. This local quality differentiation resolves the contradiction between heat dissipation performance and safety compliance.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances heat dissipation performance while satisfying safety certifications by maintaining adequate airflow and preventing foreign object entry, ensuring both safety and efficiency in electronic devices.

Implementation Method 1

One end of the heat pipe is in thermal contact with the heat source

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

cooling wind generated by the fan is directly blown to the heat dissipation fins, blown out through the heat dissipation fins

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentUS10529649B2Heat dissipation module
Publication Date: 2020.01.07 ACER INC
  • US10529649B2 patent drawing
  • US10529649B2 patent drawing
  • US10529649B2 patent drawing

AI summary

A heat dissipation module configured to dissipate heat from a heat source of an electronic device is provided. The heat dissipation module includes a heat pipe, a plurality of fins, and a fan. One end of the heat pipe is in thermal contact with the heat source. The fins are stacked up to be combined with one another and structurally propped against another end of the heat pipe. The fins form a plurality of flow inlets and a plurality of flow outlets. The fan is disposed at the flow inlets, and air flow generated by the fan flows in via the flow inlets and flows out via the flow outlets. A portion of the fin at the flow outlet forms a bending, and a pitch between any adjacent fins at the bending is less than 1 mm to be qualified to achieve a safety certification.