Heat Dissipation Unit With Directional Thermal Conductivity Layers
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Solution Overview
Problem
Ultralight and ultrathin notebook computers face challenges in heat dissipation due to their fan-less design, leading to high surface temperatures that affect normal operation and user experience.
Innovation Solution
A heat dissipation unit comprising a first thermal conductive layer and a second layer with lower thermal conductivity, arranged to prevent heat transmission in a specific direction, allowing the first layer to absorb more heat while reducing surface temperatures and enhancing user comfort.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of moving object
If a fan-less design is adopted to reduce weight and simplify structure, then device weight and structural complexity are reduced, but heat dissipation capability deteriorates leading to high surface temperatures
Solution Approach 1:
The heat dissipation system is segmented into multiple functional layers: a first thermal conductive layer for heat absorption, a second layer with lower thermal conductivity for heat blocking, and a third thermal conductive layer for lateral heat dissipation. This segmentation allows each layer to perform its specific thermal management function, effectively controlling surface temperature without requiring a fan.
Solution Approach 2:
Different regions of the heat dissipation unit have different thermal conductivity properties. The first and third layers have high thermal conductivity for heat absorption and lateral dissipation, while the second layer has low thermal conductivity to block heat transmission in the vertical direction. This local quality differentiation enables precise thermal control at different locations within the device.
2Temperature
If thermal conductivity is increased to improve heat dissipation, then heat dissipation capability is improved, but heat transmission to the user increases
Solution Approach 1:
The patent applies different thermal conductivity properties to different layers: the first thermal conductive layer has high thermal conductivity to absorb heat from the processing component, the second layer has low thermal conductivity to block heat transmission toward the user, and the third layer has high thermal conductivity to dissipate heat laterally. This local differentiation resolves the contradiction by allowing heat dissipation where needed while blocking heat where harmful.
Solution Approach 2:
The heat dissipation approach transitions from one-dimensional vertical heat flow to two-dimensional lateral heat dissipation. The third thermal conductive layer conducts heat laterally away from the high-temperature region, providing an alternative heat dissipation path that does not transmit heat upward to the user's hands.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces surface temperatures and improves user experience by directing heat away from the user and ensuring the first thermal conductive layer can absorb more heat, while maintaining the ultrathin design requirements.
Implementation Method 1
a first thermal conductive layer that directs heat that is generated by the processing component away from the processing component in a first direction
Implementation Method 2
a second layer disposed in relation to the first thermal conductive layer, and wherein the second layer has a lower thermal conductivity as compared with the first thermal conductive layer in the first direction
Data Source
AI summary
An embodiment discloses an electronic device, including: a processing component; and a heat dissipation unit thermally coupled to the processing component, the heat dissipation unit comprising: a first thermal conductive layer that directs heat that is generated by the processing component away from the processing component in a first direction, and a second layer disposed in relation to the first thermal conductive layer, where the second layer has a lower thermal conductivity as compared with the first thermal conductive layer in the first direction. Other aspects are described and claimed.