Heat Dissipator Structure with Resilient Support

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Solution Overview

Problem

Conventional heat dissipator structures fail to keep metal sheets flat, reducing conductivity area and potentially damaging electronic components due to improper attachment methods.

Innovation Solution

A heat dissipator structure featuring a heat-dissipating base with a receiving portion and a limit sliding block, combined with a conductive metal block and resilient units, which uses riveting to maintain the metal sheet's flatness and enhance contact area with electronic components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional attachment methods (screw or latch) are used to fix metal sheets, then the metal sheets can be securely attached, but the metal sheets cannot be kept flat causing reduction in conductivity area and potential damage to components

Engineering Contradiction:

Improveattachment securityVSAvoidmetal sheet flatness

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The attachment system is divided into multiple components: a clamp assembly with resilient arms that can independently apply pressure to different regions of the metal sheet, allowing each segment to be flattened and secured separately while maintaining overall flatness

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The resilient arms utilize elastic deformation parameters to dynamically adjust and maintain contact pressure, ensuring the metal sheet remains flat under varying thermal expansion and contraction conditions while securely attached

Inventive Principle:

Principle #35Parameter changes

2Ease of manufacture

If metal sheets are secured using conventional means, then attachment is achieved, but the conductivity area is reduced and components may be damaged

Engineering Contradiction:

Improveattachment easeVSAvoidcomponent damage and reduced conductivity area

Core Design Contradiction:

Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

The resilient arms act as intermediaries between the clamp assembly and the metal sheet, distributing attachment forces uniformly across the metal sheet surface and preventing concentrated stresses that could damage electronic components or reduce conductivity area

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The resilient arms are pre-loaded with elastic energy that provides cushioning force, protecting the metal sheet and underlying components from sudden mechanical shocks during attachment and preventing damage from thermal cycling stresses

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively maintains the flatness of metal sheets, increases the heat dissipation contact area, and prevents damage to electronic components, thereby improving heat dissipation efficacy.

Implementation Method 1

at least one resilient unit disposed between the assembling portion plane and the receiving portion plane to provide resilient support to the conductive metal block

Methodology Applied

Scientific EffectElasticity: Elasticity

Implementation Method 2

a heat-dissipating base including a substrate and a plurality of heat-dissipating fins disposed on the substrate

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

Some of the heat dissipators are disposed with fans to drive the air flow, and then the heat dissipation can be accelerated by air cooling effect

Methodology Applied

Scientific EffectConvection: Convection

Implementation Method 4

a conductive metal block including a body portion, an assembling portion disposed beside the body portion, and a heat dissipation plane disposed on the body portion to face away from the assembling portion and be in contact with an electronic component

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10721841B2Heart dissipator structure

Publication Date: 2020.07.21 YU QIN TECH LTD

AI summary

A heat dissipator structure includes a heat-dissipation base and a conductive metal block. The heat-dissipation base includes a substrate and a plurality of heat-dissipating fins disposed on the substrate. A receiving portion and a limit sliding block are disposed on the substrate, with the limit sliding block disposed on the receiving portion and movable within a restrictive interval. The conductive metal block includes a body portion, an assembling portion disposed beside the body portion, and a heat dissipation plane disposed on the body portion to face away from the assembling portion and be in contact with an electronic component, with the assembling portion disposed on the receiving portion, a positioning slot disposed on the assembling portion to hold the limit sliding block laterally and keep the heat dissipation plane flat, and at least one resilient unit disposed between the assembling portion plane and the receiving portion plane to provide resilient support to the conductive metal block.