Heat Exchanger Array Board Layout for Thermal Expansion Isolation
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Solution Overview
Problem
Existing heat exchanger integration in motor vehicles faces challenges such as high complexity, precision tooling requirements, assembly issues, thermal expansion leading to component failure and leakage, and inadequate thermal insulation between exchangers.
Innovation Solution
A heat exchange array comprising stacked heat exchangers connected by a first board that provides fluid communication and thermal insulation, with cooling zones to mitigate thermal expansion, and a baseplate for structural support.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If heat exchangers are integrated closely together to reduce complexity and improve compactness, then integration level improves, but thermal expansion differences cause component failure and leakage
Solution Approach 1:
The patent divides the heat exchanger assembly into separate, independently supported heat exchanger units. Each heat exchanger is mounted on its own support structure with independent mounting points, allowing them to expand and contract independently without transmitting thermal stresses to each other, thus preventing cracks and leakage while maintaining integrated functionality.
2Device complexity
If common plates are used to connect heat exchangers for better integration, then integration improves, but thermal expansion is limited causing cracks and leakage
Solution Approach 1:
The patent extracts the thermal expansion constraint from the system by removing the rigid common plate connection between heat exchangers. Instead, each heat exchanger is independently mounted on supports that allow free thermal expansion, eliminating the constraint that causes cracks and leakage while maintaining functional integration through the shared housing and fluid distribution system.
3Device complexity
If common plates are used to connect heat exchangers, then integration improves, but unwanted heat exchange between cores occurs impacting performance
Solution Approach 1:
The patent introduces thermal insulation as an intermediary material between the heat exchanger cores that are mounted on the same support structure. This insulation layer prevents unwanted thermal coupling between adjacent cores, eliminating parasitic heat exchange that would reduce system efficiency while allowing the cores to remain integrated in the same housing with shared fluid distribution.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures stable operation by maintaining fluid communication and preventing thermal expansion, reducing assembly complexity and potential leakage, while enhancing thermal insulation and structural integrity.
Implementation Method 1
the first board is configured to provide thermal insulation between the first core and the second core
Implementation Method 2
when two or more heat exchangers arranged very close to each other are subject to different rates of thermal expansion and/or contraction
Implementation Method 3
the first heat exchanger further comprises a first primary cooling zone arranged between the first primary end plate and the first board
Data Source
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AI summary
The object of the invention is, inter alia, a heat exchange array (1000) for a motor vehicle comprising a first heat exchanger (100) comprising a first core (105) for a circulation of at least first fluid therein, the first core (105) comprising a plurality of first heat exchange elements (105a) stacked in a first stacking direction between a first primary end plate (105b) and a second primary end plate (105c), the end plates (105b, 105c) delimiting the core (105), and at least one second heat exchanger (200) for circulation of at least second fluid therein, the second heat exchanger (200) further comprising a second core (205) comprising a plurality of second heat exchange elements (205a) stacked in a second stacking direction between a first secondary end plate (205b) and a second secondary end plate (205c), the end plates (205b, 205c) delimiting the second core (205), wherein the second stacking direction is substantially parallel with respect to the first stacking direction, wherein the array (1000) further comprises a first board (800) extending between the first core (105) and the second core (205), wherein the first board (800) is arranged between the first primary end plate (105b) and at least one first heat exchange element (105a), and between the first secondary end plate (205b) and at least one second heat exchange element (205a) of the second core (205).