Heat Exchanger Plate Soldering With Controlled Joint Flow
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Solution Overview
Problem
Existing heat exchanger plates for vehicle batteries face challenges in assembly and joining of connecting pieces, leading to inefficiencies in temperature control and potential overheating issues due to suboptimal soldering processes and material flow limitations.
Innovation Solution
A heat exchanger plate design featuring a plate body formed from two elements with connecting pieces joined via soldering, utilizing a solder resist to control solder flow and ensure a strong, reliable connection, and a method involving a mold soldering tool to create channels and secure the connecting pieces, enhancing assembly and manufacturing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If connecting pieces are joined to the plate body using traditional soldering methods, then the joining strength may be sufficient, but the solder flow cannot be effectively controlled leading to manufacturing defects and reduced reliability
Solution Approach 1:
A solder resist layer is introduced as an intermediary substance between the solder material and the joining surfaces. This solder resist selectively prevents solder flow in certain areas while allowing it in others, enabling precise control over solder distribution and preventing manufacturing defects such as solder bridges or insufficient filling.
2Adaptability or versatility
If the plate body is formed from two plate elements joined together, then the structural flexibility and cooling channel design are improved, but the assembly complexity and joining reliability are reduced
Solution Approach 1:
The formation of the recess and the soldering operation are merged into a single integrated process step. The recess is formed directly in one plate element while the connecting piece is simultaneously soldered into position, eliminating separate assembly operations and reducing overall complexity despite the multi-element construction.
3Strength
If connecting pieces are inserted into recesses formed between plate elements, then the connection strength is improved, but the manufacturing process complexity increases
Solution Approach 1:
The recess is pre-formed in one of the plate elements before the final assembly and soldering operation. This preliminary formation of the recess ensures proper positioning and alignment of the connecting piece, facilitating stronger joints while the integrated process keeps manufacturing manageable.
4Strength
If solder material is applied to join the plate elements and connecting pieces, then the structural integrity is improved, but the control over solder distribution and prevention of defects becomes more difficult
Solution Approach 1:
The solder resist acts as a controlling intermediary that regulates solder material distribution. It allows solder to flow only where needed to achieve proper structural integrity while preventing excess solder from causing defects such as short circuits or weak joints in critical areas.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a high-strength, reliable connection for cooling fluid supply and discharge, improving thermal management and reducing overheating risks in vehicle batteries through optimized soldering and channel formation.
Implementation Method 1
the components being heated in the mold soldering tool to a temperature above the melting temperature of the solder material used, so that the solder material melts into a liquid phase
Implementation Method 2
The solder resist is designed and set up and positioned to prevent the solder material that is molten in this phase from being blown out as a result of the internal pressure
Implementation Method 3
The plate elements are joined by soldering while incorporating the joining portion of the connecting piece in the receiving portion of the plate body
Implementation Method 4
the components being heated in the mold soldering tool to a temperature above the melting temperature of the solder material used
Data Source
AI summary
A heat exchanger plate which has a plate body formed from at least two plate elements and at least one connecting piece for a cooling fluid. Plate body and connecting piece are joined together using soldering. The connecting piece has a joining portion which is joined in a receiving portion of the plate body formed between the plate elements. A solder resist limits the flow of solder when producing the solder connection. The solder resist is able to be formed by a sealing metal, which is arranged on the joining portion of the connecting piece in front of and/behind a solder material applied to the joining portion. The solder resist is able to be formed by an annular bead resting on the end face of the receiving portion.