Soldering Apparatus TRIZ Cases

See how a catching protrusion on the outlet pipe prevents departure during brazing, improving c

See how composite conduits with aluminum main sections and copper end segments reduce HVAC syst

See how fin-tube heat exchangers with combustion chamber insulation pipes reduce manufacturing

See how a stainless steel pipe body with copper connection pipe and step-protrusion design avoi

See how storage structures contain excess copper-containing brazing material during assembly, p

See how fastening members with matched thermal expansion correct plate warpage during furnace b

See how stainless steel pipes connecting the four-way valve, compressor, and accumulator reduce

See how segmented expansion portions with varying diameters enable stronger brazed joints in sm

See how stainless steel pipe bodies with copper connection parts reduce material cost and simpl

See how a composite refrigerant pipe combines stainless steel body with copper connection porti

See how low-temperature brazing below 450°C joins stainless steel and copper refrigerant pipes

See how a detachable, height-adjustable service shelf enables one technician to safely install

See how composite conduits with aluminum main sections and copper end segments reduce HVAC weig

See how a tube sheet rising portion blocks brazing material from entering screw holes, preventi

See how aluminum alloy components with varying corrosion potentials protect critical tubes from

See how integrated tank body portions with claw-hole fitting reduce heat exchanger size while e

See how direct brazing of aluminum fins to bare steel tubes eliminates cladding, reduces interm

See how a sealing aperture and brazing process secure metallic tubular closed ends for high-pre

See how a two-member segmented coupling header reduces assembly complexity and dimensional prec

See how resilient protrusions and L-shaped caps enable direct brazing of heat exchanger plates

See how brazing aluminum intercommunicating pipes prevents water retention and rubbing damage w

See how a coil-spring microchannel tube eliminates headers to reduce manufacturing cost and vol

See how a two-member segmented coupling header reduces manufacturing complexity and dimensional

Annealing after eutectic joining helps copper and aluminum tubes form stronger, more uniform metallurgical joints for evaporator reliability.

Containment means isolate the desiccator during brazing to prevent moisture pollution, improve joint quality, and reduce leak risk.

An uninterrupted gas line keeps chamber and supply pressures aligned during substrate bonding, preventing premature contact and yield loss.

Replace laser welding with busbar pin holes and removable solder pins to improve battery module assembly, quality control, and rework.

An exothermic trigger drives a mechanical contact to permanently bypass failed cells with low resistance, high current capacity, and minimal loss.

Pin-hole busbars and removable solder pins replace laser welding, improving battery module quality control, rework, and assembly speed.

Inner-surface brazing of pipe members in a battery heat exchanger cuts sacrificial-layer material use while keeping sealing and assembly efficient.

Direct gas-line routing keeps chamber and supply pressure aligned, preventing premature substrate contact and improving bonding uniformity.

A solder resist barrier controls solder flow when joining heat exchanger plate connectors, preventing blowout during internal pressure channel forming.

Longitudinal webs and grooves create a uniform solder gap for battery cooling plate connections, improving joint strength, tightness, and assembly reliability.

Openings and bends in the spring-terminal joint control solder paste and vent air bubbles, creating a more stable SPD thermal link.

Non-parallel die package receptacles and angled nozzles equalize fluid travel paths for more consistent flux and solder residue removal.

Continuous furnace brazing joins the middle plate, cooling plate, and reinforcements to cut welding defects and simplify battery pack case assembly.

Vision-guided robotic cover placement, magnetic hold-down, and controlled heating improve hermetic package sealing accuracy and changeover speed.

Polyetherimide lenses and heat-resistant barrel materials keep near-infrared vehicle imaging stable through 230-260°C reflow soldering.

Multiple laser soldering seams join the solder strip to the junction box plate, reducing positioning complexity while improving connection reliability.

A bent spring interface controls solder paste volume and air release, improving terminal joint strength and stable surge cutoff.

Opposed pressing members stabilize wire fixation on both solar cell surfaces, cutting tabbing steps and helping prevent wire fusion.

Dual laser seams join the solder strip to the junction box plate with less positioning effort and more stable thermal-shock resistance.

Model-based hot gas control keeps vertically stacked components on target temperature profiles for defect-free curing and higher throughput.

A solder-accommodating groove guides brazing in thin battery shells to improve sealing quality while reducing soldering difficulty, stress, and failure risk.

Laser brazing melts only the aluminum lead around a molybdenum pin, creating a strong joint while limiting brittle intermetallic formation.

A removable solder pin links bus bars and voltage sensing members, simplifying assembly, inspection, and rework in battery modules.

A solder stop controls solder flow at the connection port, improving heat exchanger plate assembly reliability and process safety.

Arcuate port ribs and matching grooves stabilize brazed battery cooling plate joints, easing assembly while lowering thermal resistance.

A solder stop controls solder flow at the cooling port joint, improving heat exchanger plate assembly quality and reducing leakage risk.

A unified conveyor path moves back and front films with suction holding and a reusable pressing tool to simplify solar cell string production.

Pressure-expanded zigzag plates create flat heat exchanger surfaces, improving contact area while reducing filler material and mold cost.

Segmented electrode tabs let faulty cells be cut out and re-soldered without peeling joints, reducing tab damage and preserving solder quality.

Selective micro-heater expansion shifts offset chips on a temporary substrate for precise alignment and laser bonding to a circuit substrate.

Directed vapor flow through an airflow control cover holds solder balls in place during reflow, reducing PCB mounting defects.

A soldering bridge links thermal bonding points across dissimilar battery tabs to improve bond consistency and lower electrical resistance.

Pulsed laser transfer places flux or connection material onto sub-100 μm optoelectronic pads with high accuracy and lower short-circuit risk.

A solder resist controls molten solder flow at heat exchanger plate joints, improving connector strength and battery cooling reliability.

Brazed plated-steel flow paths improve battery cooling, liquid tightness, and corrosion resistance without damaging protective plating.

Multiple clamping portions align and heat ribbons on back-contact cells, improving soldering precision and production efficiency.

A flat U-flow tube and stamped manifold separate supply and return channels to stop bypass flow and improve battery cell cooling.

Recessed manifold chambers isolate flow and return paths in a U-flow battery cooling tube, preventing bypass flow and improving heat transfer.

A layered ceramic stack separates dielectric and insulating functions to boost wafer holding force while maintaining high-voltage insulation.

Multiple chamber regions and vertically positioned stages let substrates be dipped, preheated, and reflowed in parallel to raise soldering throughput.

Parallel suction conveyor belts and a reusable pressing tool simplify front and back film transfer for continuous solar cell string production.

A weld path that starts and ends opposite the pressure release valve limits heat conduction and prevents valve deformation in power storage cells.

By extending metallization beyond the joint and thinning solder or braze, this case reduces thermal expansion stress and ceramic cracking.

Dual-region laser soldering forms seams through the solder strip and into the plate, cutting desoldering risk and simplifying strip positioning.

Laser brazing melts only the aluminum lead around a channel-held molybdenum pin, creating a strong joint while avoiding brittle metal mixing.

Direct gas delivery keeps chamber and supply pressure aligned, preventing premature substrate contact and improving bonding uniformity.

An EO PCB housing, laser-welded collimators, and a flexible crystal holder shrink high-power visible laser heads while reducing thermal stress.

Low-surface-tension immersion, ultrasonic flow, and low-angle spray clear flux from sub-20-micron die stack openings and reduce trapped residue.

Multiple ribbons are pre-positioned, clamped, trimmed, and heated together to improve back-contact cell soldering precision and throughput.

Negative pressure replaces manual force to join heated plastic pipes at skewed angles with even circumferential pressure and a liquid-tight seal.

Pre-fixing solder strips before film lamination enables uniform heating without front-side pressing, reducing bubbling, cold joints, and strip shift.

Flux-assisted hot pressing forms superconducting tape joints without solder residues, lowering resistivity and preserving mechanical strength.

A pure iron interphase forms a dense bond between coaxial tubes, improving heat transfer, fluid tightness, and pressure resistance.

A dual-metal adapter shifts resistive heating into a higher-resistivity outer tube, bonding low-resistivity parts with less electrode overheating.

Two-phase laser heating preheats substrates before solder fusion, cutting reflection losses and burning risk in terminal-face electrical joining.

A transition alloy foil and vacuum diffusion welding join a nickel ferrite ceramic inert anode to a metal block with crack-resistant strength.

Localized TIG heat forms a stainless steel-copper fillet lap joint that suppresses oxide buildup and stress to prevent cracking.

Laser diffusion bonding and Bessel-beam fault lines enable fast liquid lens array separation while preserving hermetic seals and optical integrity.

MMC cold plates use metallization and transient liquid-phase bonding to cut interface thermal resistance while handling CTE mismatch.

Helical flow paths in stacked plates keep coolant temperature more uniform and expand heat-transfer area for better heat sink dissipation.

Aged 3XXX-series aluminium baseplates reduce Si diffusion and liquid film migration, improving brazed joint strength without cladding.

A steel-copper bi-metal connector enables brazed sensor mounting while limiting solder heat transfer and resisting vibration damage.

An organic-acid-coated zinc, copper, or magnesium interlayer joins aluminum at lower temperature and pressure while limiting deformation.

A low-modulus foam shell around a high-modulus core cuts stress shielding in hip stems while preserving load support and bone remodeling.

Intermeshing needles transfer torque between conical members, eliminating friction surface wear and hydraulic lubrication requirements.

A sealed vessel with a transparent window enables external laser heating for precise material joining.