MMC Liquid Flow-Through Plate Bonding for Low-Resistance Cooling
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Solution Overview
Problem
Electronic device packages with liquid-cooled cold plates experience additional temperature rise due to coefficient of thermal expansion (CTE) differences between the electronic device layer and the cold plate, requiring multiple material interfaces that complicate heat transfer.
Innovation Solution
A high-performance liquid flow-through plate is constructed using metal matrix composite (MMC) substrates with metallized surfaces and a braze foil, where a high-temperature and high-pressure bake creates transient liquid-phase bonding, eliminating the need for multiple interfaces by directly attaching the electronic device layer to the cold plate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If multiple material interfaces are used to accommodate CTE differences, then the structural integrity and CTE matching are improved, but the thermal resistance increases and heat transfer efficiency deteriorates
Solution Approach 1:
The patent merges the electronic device layer and cold plate into a single integrated structure, eliminating the need for separate material interfaces. This integration maintains CTE compatibility while removing the thermal resistance that would be introduced by multiple interfaces, directly resolving the contradiction between structural stability and heat transfer efficiency.
2Stability of the object's composition
If multiple material interfaces are used to accommodate CTE differences, then the structural integrity is improved, but the device complexity increases
Solution Approach 1:
The patent combines multiple functional layers into a single integrated cold plate structure, reducing the number of material interfaces from multiple separate layers to a unified design. This simplification maintains the necessary CTE matching properties while significantly reducing device complexity and the number of interfaces required.
3Loss of energy
If direct attachment of electronic device layer to cold plate is implemented, then the heat transfer efficiency is improved, but the CTE mismatch problem worsens
Solution Approach 1:
The patent applies local quality by creating a metallized surface layer on the cold plate with specific CTE properties that match the electronic device layer. This localized modification of the cold plate surface provides the necessary CTE compatibility at the interface while maintaining the overall direct attachment structure for efficient heat transfer.
Solution Approach 2:
The patent uses composite material structure with a metallized surface layer on the cold plate. This composite approach combines materials with different CTE properties in a layered configuration, where the metallized surface provides CTE matching with the electronic device layer while the bulk cold plate material maintains thermal conductivity for efficient heat transfer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution significantly reduces thermal rise by enabling direct heat transfer between electronic devices and coolant, improving thermal efficiency and reducing the complexity of material interfaces.
Implementation Method 1
The metallizing includes one of physical vapor deposition (PVD) and electroplating
Implementation Method 2
The metallizing includes one of physical vapor deposition (PVD) and electroplating
Implementation Method 3
executing a high-temperature and high-pressure bake whereby material of the braze foil diffuses into the metallized surface
Implementation Method 4
the executing of the high-temperature and high-pressure bake causes a transient liquid-phase bonding between the material of the braze foil and the metallized surface
Data Source
AI summary
A process for building a high-performance liquid flow-through plate is provided and includes providing a substrate formed of metal matrix composite (MMC) material, metallizing a surface of the substrate to reform the surface into a metallized surface, placing a braze foil on the metallized surface and executing a high-temperature and high-pressure bake whereby material of the braze foil diffuses into the metallized surface.