Photovoltaic Junction Box Plate Soldering Seams for Stable Connections
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Solution Overview
Problem
The existing methods for connecting a solder strip to a plate in a photovoltaic module, such as soldering and laser soldering, face challenges like complex machining operations and thermal shock-induced desoldering, leading to unreliable connections and poor efficiency.
Innovation Solution
A photovoltaic module design that uses laser soldering with a plate having distinct regions, where the soldering seams extend through the solder strip into the plate, ensuring a reliable connection without the need for additional solder material, and a manufacturing method that simplifies the positioning process by focusing on the plate's regions for efficient soldering.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If soldering with solder material is used to connect the solder strip to the plate, then the connection can be formed, but the machining operations become complicated and the connection reliability deteriorates due to thermal shock-induced desoldering
Solution Approach 1:
The invention extracts and eliminates the solder material from the connection process. Instead of using traditional soldering with separate solder material that requires complex machining and suffers from thermal shock issues, the patent directly melts and bonds the solder strip to the plate through laser soldering, removing the intermediate solder material entirely.
Solution Approach 2:
The invention replaces the traditional mechanical soldering process with laser soldering. The laser beam directly melts the solder strip and plate surface to form a reliable connection, substituting the mechanical heating and solder material application process with a precise laser-based thermal process that eliminates machining complexity and improves connection reliability.
2Reliability
If laser soldering is used to directly melt the plate and solder strip, then the connection reliability improves and no solder material is needed, but the soldering efficiency deteriorates due to poor positioning
Solution Approach 1:
The invention performs preliminary positioning of the solder strip relative to the plate before the laser soldering process begins. By pre-aligning the components and establishing accurate positional relationships, the system eliminates positioning delays during the actual soldering operation, thereby improving soldering efficiency while maintaining the high reliability benefits of direct laser soldering.
3Productivity
If the solder strip positioning is simplified to improve production efficiency, then the productivity increases, but the positioning precision may deteriorate
Solution Approach 1:
The invention implements a self-positioning mechanism where the solder strip and plate are designed with complementary geometric features that automatically align them during assembly. This self-service positioning approach eliminates the need for complex external positioning systems, maintaining high positioning precision while simplifying the overall positioning process and improving production efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances production efficiency by reducing the complexity of solder strip positioning and ensures a reliable connection between the solder strip and the plate, improving the overall reliability and efficiency of the photovoltaic module.
Implementation Method 1
laser-soldering the solder strip and the plate by using a laser head
Implementation Method 2
The plate and the solder strip can be directly molten to form a soldering seam by the laser soldering
Data Source
AI summary
A photovoltaic module, including a laminate including a solder strip; and a junction box arranged on a surface of the laminate and including a plate connected to the solder strip by laser soldering. The plate has a first region and a second region, in which a region covered by the solder strip on the plate is the first region, and a region not covered by the solder strip on the plate is the second region. A soldering seam formed by laser soldering includes a first soldering seam and a second soldering seam. The first soldering seam is located in the first region, and the first soldering seam extends through the solder strip into the plate along a thickness direction of the laminate. The second soldering seam is located in the second region, and the second soldering seam extends directly into the plate along the thickness direction of the laminate.