Temporary Carrying Substrate With Micro-Heater Chip Alignment
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Solution Overview
Problem
Current chip arrangement methods, such as the pick-and-place method, lack efficiency in accurately positioning chips due to limitations in fine-tuning chip placement and alignment.
Innovation Solution
A chip transferring device and method utilizing a temporary carrying substrate with micro heaters, where the substrate is heated to generate thermal expansion, allowing for precise alignment and positioning of chips on a circuit substrate, and a laser module for bonding the chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the pick-and-place method is used to separate chips by a predetermined distance, then chip arrangement is achieved, but positioning precision and alignment accuracy are insufficient
Solution Approach 1:
The patent changes the physical state of the temporary carrying substrate by controlling thermal expansion parameters. By heating specific regions of the substrate, the dimensional parameters change, enabling precise adjustment of chip positions relative to the circuit substrate, thereby achieving high positioning precision without complex mechanical alignment mechanisms
Solution Approach 2:
The patent directly applies thermal expansion by incorporating heating elements (such as resistive heaters) into the temporary carrying substrate. By controlling the temperature distribution, specific areas of the substrate expand differentially, allowing offset chips to be moved to correct positions and achieve precise alignment with the circuit substrate
2Measurement precision
If thermal expansion is used to move offset chips to correct positions, then positioning accuracy is improved, but additional heating control mechanisms are required
Solution Approach 1:
The heating control system is segmented into multiple independent heating zones, each corresponding to specific chip regions. This allows selective heating of only the areas where offset chips need correction, rather than heating the entire substrate. Each heating zone can be independently controlled, simplifying the overall control logic while achieving precise alignment
Solution Approach 2:
The system incorporates feedback mechanisms where the positions of chips are monitored (through vision systems or position sensors), and this information feeds back to the heating control module. The control module then adjusts the heating parameters accordingly to move offset chips to their correct positions, creating a closed-loop control system that achieves high precision without excessive complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate and efficient alignment and bonding of chips by using thermal expansion to correct offset chips and a laser for soldering, improving the precision and efficiency of chip placement.
Implementation Method 1
the micro heater is allowed to be configured to heat the temporary carrying substrate through the signal control module, thereby causing the temporary carrying substrate to generate thermal expansion to facilitate moving a corresponding one of the chips
Implementation Method 2
bonding the chips on the circuit substrate through a laser generating module
Data Source
AI summary
A temporary carrying substrate, a chip-transferring device and a chip transferring method are provided. The chip-transferring device includes a signal control module, a chip-carrying module and a chip-transferring module. The chip-transferring module is allowed to be configured to carry a temporary carrying substrate through the signal control module, and the temporary carrying substrate includes a plurality of micro heaters disposed thereinside or thereoutside. When the chip-transferring module needs to be configured to carry the temporary carrying substrate, a plurality of chips are arranged on a plurality of chip placement areas of the temporary carrying substrate and arranged in a predetermined arrangement shape. When the micro heater needs to be used, the micro heater is allowed to be configured to heat the temporary carrying substrate through the signal control module, thereby causing the temporary carrying substrate to generate thermal expansion to facilitate moving a corresponding one of the chips.