Photovoltaic Junction Box Laser Soldering for Reliable Plate Connections
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Solution Overview
Problem
Existing photovoltaic module connection methods, such as soldering and laser welding, face challenges with complex machining operations, thermal shock issues, and poor reliability due to mismatched melting points, leading to inefficient production and unreliable connections between the solder strip and the plate in the junction box.
Innovation Solution
A photovoltaic module design utilizing laser soldering with multiple soldering seams, including first and second seams extending through and into the plate, respectively, and optionally a third seam, to ensure reliable connections without the need for additional solder material, reducing positioning complexity and enhancing production efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If soldering with solder material is used to connect the solder strip and the plate, then the connection can be achieved, but the machining operations become complicated and the connection reliability deteriorates due to thermal shock and melting point mismatch
Solution Approach 1:
The patent removes the solder material from the connection process entirely, using direct laser welding between the solder strip and the plate. This extraction of the intermediate solder material simplifies the machining operations while maintaining connection reliability through direct metallurgical bonding.
Solution Approach 2:
The patent replaces the traditional thermal soldering process with laser welding technology. This substitution eliminates the need for solder material preparation and melting, while the laser-induced metallurgical bond provides superior resistance to thermal shock compared to traditional solder joints.
2Reliability
If laser soldering is used to directly melt the plate and solder strip, then the connection reliability improves and solder material preparation is eliminated, but the soldering efficiency deteriorates due to poor positioning
Solution Approach 1:
The patent implements preliminary positioning actions before the laser welding process. The solder strip is pre-positioned on the plate with precise alignment features, and the laser head is pre-positioned according to the plate coordinates. This preliminary preparation eliminates positioning issues during welding, maintaining high soldering efficiency while ensuring reliable connections.
3Reliability
If multiple soldering seams are formed by laser soldering, then the connection reliability improves, but the positioning difficulty increases
Solution Approach 1:
The patent applies different soldering seam configurations to different regions of the plate. The first soldering seam extends through the solder strip into the plate, while the second soldering seam extends directly into the plate without through the solder strip. This localized differentiation optimizes connection reliability in different areas while the automated laser system manages the complexity of creating multiple seam types.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method improves production efficiency by simplifying the soldering process, ensuring robust connections, and maintaining high reliability through controlled laser parameters and seam configurations, thereby optimizing manufacturing speed and yield.
Implementation Method 1
The solder strip and the plate may be fixed and connected by laser soldering. The plate and the solder strip can be directly molten to form a soldering seam by the laser soldering.
Implementation Method 2
The plate and the solder strip can be directly molten to form a soldering seam by the laser soldering.
Data Source
AI summary
A photovoltaic module, including a laminate including a solder strip; and a junction box arranged on a surface of the laminate and including a plate connected to the solder strip by laser soldering. The plate has a first region and a second region, in which a region covered by the solder strip on the plate is the first region, and a region not covered by the solder strip on the plate is the second region. A soldering seam formed by laser soldering includes a first soldering seam and a second soldering seam. The first soldering seam is located in the first region, and the first soldering seam extends through the solder strip into the plate along a thickness direction of the laminate. The second soldering seam is located in the second region, and the second soldering seam extends directly into the plate along the thickness direction of the laminate.