Heat Pipe PCB Structure for Thermal Management
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Solution Overview
Problem
Conventional printed circuit boards struggle to effectively dissipate heat beyond the immediate vicinity, leading to increased air temperature and reduced thermal conductivity, which affects electronic components and overall system stability.
Innovation Solution
A heat dissipating type printed circuit board structure that incorporates a heat pipe connected to the board, featuring a substrate with a signal circuit, a heat dissipating layer, and a through hole for the heat pipe, with an adhering layer for enhanced thermal contact and a condensing end with heat dissipating fins to efficiently transfer heat away from the board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat dissipating methods (heat dissipating holes, metal films, metal lumps, or heat dissipating paste) are used on the printed circuit board, then heat can be conducted to these structures, but the heat cannot be effectively conducted to a farther end and only increases the temperature of surrounding air
Solution Approach 1:
The patent introduces a heat pipe as an intermediary thermal conduction component between the printed circuit board and the external environment. The heat pipe's heated end contacts the PCB through a through-hole, serving as a mediator to transfer heat away from the board to a farther end, preventing heat accumulation and avoiding thermal equilibrium with surrounding air
Solution Approach 2:
The patent transitions from two-dimensional surface-level heat dissipation (metal films, paste on PCB surface) to three-dimensional thermal conduction by extending heat away from the board through the heat pipe structure, conducting heat to a farther end in spatial dimension, thereby improving heat dissipation efficiency
2Reliability
If heat dissipating structures are added to the printed circuit board, then heat conduction capability is improved, but the temperature of surrounding air increases and thermal equilibrium is reached, causing heat dissipating effect to drop gradually
Solution Approach 1:
The patent extracts the heat dissipation function from the printed circuit board itself by introducing a separate heat pipe component. The heat pipe is inserted through a through-hole in the PCB, separating the heat generation location (on PCB) from the heat dissipation location (external environment), thereby preventing surrounding air temperature increase and maintaining system reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively lowers the temperature of the printed circuit board and its components, maintaining stable operation by efficiently conducting heat away from the board and preventing heat accumulation, thereby enhancing thermal performance and preventing thermal equilibrium issues.
Implementation Method 1
The heat pipe has a heated end, and a condensing end extended from the heated end... The substrate includes a through hole passing through the heat dissipating layer... for conducting heat with a heat pipe
Implementation Method 2
The heat dissipating layer is disposed on another surface of the substrate... for providing high-performance heat dissipations for the printed circuit board
Data Source
AI summary
A heat dissipating type printed circuit board and its structure for conducting heat with a heat pipe include a substrate, a signal circuit disposed on a surface of the substrate and electrically coupled to an electronic component, a heat dissipating layer disposed on another surface of the substrate, and at least one heat pipe, each having a heated end and a condensing end extended from the heated end. The substrate includes a through hole passing through the heat dissipating layer, and the heat dissipating layer includes an adhering layer disposed at a surface proximate to the surroundings of the heat pipe, and a distal end of the heated end of the heat pipe is covered by the adhering layer, and the adhering layer is extended from the surface of the heat dissipating layer to a corresponding position of the electronic component.