Heat pump module
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Solution Overview
Problem
The integration of components in a heat pump cycle device leads to close proximity of high-temperature and low-temperature flow paths, causing heat transfer and potential performance degradation due to temperature differences, which affects the efficiency and performance of the heat pump system.
Innovation Solution
A heat pump module with a flow path forming member that includes high-temperature and low-temperature flow paths, integrated with a heat transfer suppressor to minimize heat transfer between these paths, thereby preventing performance degradation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If components are integrated in a heat pump cycle device, then device complexity is reduced and compactness is improved, but heat transfer between high-temperature and low-temperature flow paths occurs causing performance degradation
Solution Approach 1:
A partition wall is introduced as an intermediary structure between the high-temperature flow path and low-temperature flow path. This partition wall physically separates the two flow paths while allowing both to coexist in the integrated heat pump module, thereby preventing harmful heat transfer between them.
Solution Approach 2:
The flow path forming member is segmented into distinct high-temperature and low-temperature flow path regions by the partition wall. This segmentation allows independent temperature zones to be maintained within the integrated component structure, preventing thermal interference while preserving compactness.
2Volume of moving object
If high-temperature and low-temperature flow paths are placed in close proximity, then device compactness is improved, but heat transfer between paths causes efficiency loss
Solution Approach 1:
The partition wall serves as a thermal barrier that enables close placement of high-temperature and low-temperature flow paths while preventing efficiency loss. It allows the compact integrated design to be maintained without sacrificing heat pump performance.
Solution Approach 2:
The partition wall creates locally distinct thermal zones within the flow path forming member. Each region (high-temperature and low-temperature) maintains its specific thermal characteristics, allowing efficient heat exchange with respective heat media while preventing cross-contamination between temperature zones.
3Reliability
If heat transfer suppressor is added to prevent heat transfer, then performance degradation is prevented, but device complexity increases
Solution Approach 1:
The partition wall is merged into the flow path forming member structure, becoming an integral part of the component housing rather than a separate add-on element. This integration achieves heat transfer suppression while minimizing increases in overall device complexity.
Solution Approach 2:
The partition wall performs multiple functions: it separates flow paths, prevents heat transfer, and serves as a structural element of the flow path forming member. This multi-functionality achieves performance stability without proportionally increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The heat pump module effectively suppresses heat transfer between refrigerant and heat medium flow paths, maintaining efficiency and preventing performance degradation, thus enhancing the overall performance of the heat pump cycle and heat medium circuit.
Implementation Method 1
a heat transfer suppressor configured to suppress transfer of heat between the refrigerant flow path and the heat medium flow path
Data Source
AI summary
A compressor compresses and discharges a refrigerant. A component causes refrigerant discharged from the compressor to flow. A flow path forming member is attached with the compressor and the component and defines a refrigerant flow path and a heat medium flow path. The flow path forming member has a high-temperature flow path, a low-temperature flow path, and a heat transfer suppressor. The high-temperature flow path, as one of the refrigerant flow path and the heat medium flow path, causes refrigerant or heat medium exhibiting high temperature due to heat of high-pressure refrigerant. The low-temperature flow path, as one of the refrigerant flow path and the heat medium flow path, causes refrigerant or heat medium exhibiting low temperature. The heat transfer suppressor suppresses transfer of heat between the refrigerant flow path and the heat medium flow path.