Heat Radiator Attachment Member Design for Vibration Suppression
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Solution Overview
Problem
Existing heat radiators attached to electronic substrates are prone to vibration due to external stress, which can damage electronic components and hinder their performance.
Innovation Solution
A heat radiator design featuring first and second fins thermally connected, with an attachment member attached to a portion of the fins or second fin positioned closer to the substrate than the first fins, providing enhanced stability and attachment to suppress vibration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the attachment groove insertion part is inserted into the attachment groove of the outermost radiation panel, then the heat radiator can be attached to the electronic substrate, but the distance between the attachment groove insertion part and the electronic substrate attachment leg part is shortened, and an interval is generated between the outermost radiation panel and the substrate, causing the heat radiator to vibrate easily due to external stress
Solution Approach 1:
The invention transitions from a two-dimensional attachment within the radiation panel plane to a three-dimensional attachment by utilizing the vertical space above the radiation panel. The attachment groove is formed in the plate-like member (base of fins) rather than in the radiation panel, allowing the attachment groove insertion part to extend upward and engage with the electronic substrate from above, thereby eliminating the interval and improving stability without compromising ease of operation
Solution Approach 2:
The plate-like member serves as an intermediary structure between the radiation panels and the electronic substrate. By forming the attachment groove in this intermediate plate-like member rather than directly in the radiation panel, the invention creates a stable mounting point that connects both the heat radiator structure and the electronic substrate, preventing vibration while maintaining easy attachment
2Ease of operation
If the attachment groove insertion part is inserted into the attachment groove of the outermost radiation panel, then the heat radiator can be attached to the electronic substrate, but an interval is generated between the outermost radiation panel and the substrate, causing electronic components to be damaged by vibration from external stress
Solution Approach 1:
The attachment groove is repositioned from the radiation panel level to the plate-like member level, utilizing the vertical dimension to create a proper attachment point. This dimensional change allows the attachment groove insertion part to make direct contact with the electronic substrate, eliminating the harmful interval and protecting electronic components from vibration damage while keeping the attachment process simple
Solution Approach 2:
The plate-like member acts as a mediator that provides a stable attachment interface between the heat radiator and the electronic substrate. By positioning the attachment groove in this intermediary structure, the invention ensures that the heat radiator is firmly secured to the substrate, preventing vibration that could damage electronic components while maintaining ease of operation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces vibration-induced damage to electronic components while maintaining efficient heat transfer and radiation characteristics.
Implementation Method 1
a second fin 147a facing the first fin 141a, thermally connected to the first fin 141a
Data Source
AI summary
Provided are an electric device and a heat radiator capable of suppressing vibration caused by external stress of the heat radiator. The electric device includes a substrate; an electronic component attached to the substrate; and a heat radiator including at least one first fin, and a second fin facing the first fin, thermally connected to the first fin, and provided at a position closer to an attachment surface of the substrate than any of the first fins. The heat radiator is thermally connected to the electronic component, and one end of an attachment member is attached to the first fin, and another end of the attachment member is attached to the substrate. The attachment member has a height with respect to the attachment surface that is higher than a thickness of the first fin.