Heat Sink Core Element as Supporting Structure
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Solution Overview
Problem
Conventional electrical devices in fields like communication technology and Industry 4.0 generate significant heat, requiring efficient cooling solutions that are both compact and flexible, as traditional heat sinks are often bulky and inflexible.
Innovation Solution
The use of a heat sink core element as a supporting structure that integrates heat absorption and dissipation functions, allowing electrical functional assemblies to be securely fastened to its face walls, with optional external elements for enhanced cooling and modular configuration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional heat sinks are used for cooling electrical devices, then heat dissipation is achieved, but the device becomes bulky and inflexible
Solution Approach 1:
The heat sink is merged with the supporting structure to form a single integrated component. The heat sink core element serves dual purposes: providing mechanical support for the electrical functional assembly and acting as a heat dissipation structure. This integration eliminates the need for separate housing and heat sink components, achieving compactness while maintaining effective heat dissipation.
Solution Approach 2:
The heat sink core element performs multiple functions simultaneously: it provides structural support, enables fastening to mounting rails, and facilitates heat dissipation from electrical components. This multi-functionality reduces the overall number of components needed, creating a compact and flexible device that maintains effective cooling.
2Temperature
If conventional heat sinks are used, then cooling is provided, but the device lacks flexibility and modular configuration capability
Solution Approach 1:
The device is segmented into modular components including the heat sink core element, external elements, and electrical functional assemblies. The heat sink core element can be combined with different external elements and functional assemblies to create customized configurations, enabling flexible adaptation to various applications while maintaining effective cooling.
Solution Approach 2:
The device design allows for dynamic reconfiguration by enabling different combinations of external elements and functional assemblies to be attached to the heat sink core element. This modular approach provides adaptability and versatility, allowing the same core structure to support various configurations based on specific cooling and functional requirements.
3Temperature
If separate housing and heat sink components are used, then structural support and cooling are provided, but device complexity increases
Solution Approach 1:
The housing and heat sink are merged into a single heat sink core element that serves as both the structural support and the heat dissipation component. This integration reduces the number of parts, simplifies assembly, and lowers overall device complexity while maintaining both structural integrity and effective cooling functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient heat dissipation through convection and potentially eliminates the need for additional housings, providing a compact, thermally robust, and modular electrical device suitable for various applications.
Implementation Method 1
heat can be absorbed, distributed and optionally dissipated, for example via a convection flow
Data Source
AI summary
An assembly of an electrical device includes: at least one electrical functional assembly which has a supporting element and electrical or electronic functional components arranged on the supporting element; a fastening device for fastening the electrical device to a higher-level assembly; a heat sink core element having at least one face wall; and an external element connectable to the heat sink core element. The heat sink core element forms a supporting structure of the electrical device on which supporting structure the fastening device is arranged. The external element is connectable to the heat sink core element such that the at least one electrical functional assembly is accommodated between the at least one face wall of the heat sink core element and the external element.