Heat Sink Guiding Surface for Coolant Flow Control

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Solution Overview

Problem

Conventional spray cooling systems are insufficient in dissipating heat from electronic components, leading to overheating and reduced cooling efficiency due to inadequate heat sink design and coolant splashing.

Innovation Solution

A heat sink with a thermally conductive base featuring a guiding surface that directs coolant flow to enhance heat dissipation and prevent coolant splashing, thereby improving the heat dissipation efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If coolant is sprayed vertically onto the cooling device, then the cooling device can be cooled, but the coolant splashes outward and cannot sufficiently perform heat exchange

Engineering Contradiction:
Improvecooling efficiencyVSAvoidcoolant flow control
Core Design Contradiction:
Loss of energyVSEase of operation

Solution Approach 1:

The patent changes the coolant flow direction from vertical spraying to horizontal wall surface flow along the guiding surface. This dimensional change allows the coolant to flow smoothly along the inclined surface without splashing outward, extending the heat exchange path and improving cooling efficiency

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The guiding surface is designed with a specific inclination angle (α) relative to the vertical direction. By optimizing this angular parameter, the coolant flow direction is controlled to follow the surface smoothly, preventing splashing while maximizing heat exchange contact time and area

Inventive Principle:
Principle #35Parameter changes

2Device complexity

If the cooling device is attached to one side of the heat source, then the structure is simple, but heat dissipation is insufficient causing overheating

Engineering Contradiction:
Improvecooling device structureVSAvoidheat source temperature
Core Design Contradiction:
Device complexityVSTemperature

Solution Approach 1:

The heat sink base extends to cover the heat source from multiple sides rather than being attached to a single side. This spatial extension allows the coolant to flow along walls of the heat source from multiple directions, significantly improving heat dissipation capability while maintaining structural simplicity

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The heat sink base serves multiple functions: it acts as a thermal conduction path, provides a guiding surface for coolant flow, and extends to cover multiple sides of the heat source. This multi-functionality improves heat dissipation without requiring additional separate components

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The heat sink effectively guides coolant flow to enhance heat exchange with the heat sink, reducing the likelihood of coolant splashing and improving overall heat dissipation efficiency.

Implementation Method 1

The thermally conductive base has an inner bottom surface configured to be thermally coupled to the heat source

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

the guiding surface can guide the coolant flowing as the wall surface flow to pass by the second surface of the heat sink to dissipate heat generated by the heat source effectively

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentUS20250142780A1Heat sink
Publication Date: 2025.05.01 COOLER MASTER CO LTD
  • US20250142780A1 patent drawing
  • US20250142780A1 patent drawing
  • US20250142780A1 patent drawing

AI summary

A heat sink includes a thermally conductive base. The thermally conductive base has a first surface, a second surface, a guiding surface and an accommodating recess. The second surface faces away from the first surface. The guiding surface are connected to the first surface and the second surface. The guiding surface is not perpendicular to the first surface and the second surface. The accommodating recess is located at the first surface. The thermally conductive base has an inner bottom surface and an inner annular side surface which surround and form the accommodating recess. The inner annular side surface is connected to the inner bottom surface. The accommodating recess accommodates a heat source. The inner bottom surface is thermally coupled to the heat source.