Heat Sink Light Source Integration Reducing Airflow Resistance

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Solution Overview

Problem

Conventional heat dissipation units with integrated light sources suffer from reduced heat dissipation efficiency due to increased flow resistance caused by additional wires and suboptimal placement of light sources, which impede airflow and diminish illumination effectiveness.

Innovation Solution

A heat dissipation unit design featuring light sources integrated on a circuit board, eliminating additional wires and positioning them closer to the air outlet, where light beams are efficiently utilized to enhance brightness and illumination while minimizing flow resistance by avoiding the airflow path.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Use of energy by moving object

If additional wires are connected to light sources to transmit electricity, then light sources can be powered, but flow resistance increases and heat dissipation efficiency decreases

Engineering Contradiction:
Improvelight source power supplyVSAvoidheat dissipation efficiency
Core Design Contradiction:
Use of energy by moving objectVSProductivity

Solution Approach 1:

The patent merges the light source mounting function with the heat sink structure itself. The light sources are directly mounted on the heat sink's surface, eliminating the need for separate wire connections through the airflow path. This integration allows electrical power to reach light sources without introducing additional flow resistance elements.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent extracts the wires from the airflow path by mounting light sources directly on the heat sink. This removal of wires from the critical airflow region eliminates the flow resistance and turbulence that wires would create, while still maintaining electrical connectivity to the light sources.

Inventive Principle:
Principle #2Taking out (Extraction)

2Illumination intensity

If light sources are projected from the inner wall of the fan to face the heat sink, then lighting efficiency is improved, but flow resistance increases and flow field changes

Engineering Contradiction:
Improvelighting efficiencyVSAvoidheat dissipation efficiency
Core Design Contradiction:
Illumination intensityVSProductivity

Solution Approach 1:

Instead of projecting light from the fan's inner wall toward the heat sink, the patent inverts the approach by mounting light sources directly on the heat sink's surface. This reversal positions the light sources at the optimal location for both illumination and minimal airflow interference, eliminating the need for long light paths through the fan structure.

Inventive Principle:
Principle #13The other way round (Inversion)

Solution Approach 2:

The patent applies local quality by positioning light sources specifically on the heat sink surface where they are most needed for illumination, rather than distributing them throughout the fan structure. This localized placement optimizes both lighting efficiency and heat dissipation by concentrating light emission at the target area without disrupting overall airflow.

Inventive Principle:
Principle #3Local quality

3Illumination intensity

If light sources are disposed in the fan, then light can be emitted, but flow resistance increases due to obstruction of airflow path

Engineering Contradiction:
Improvelight emissionVSAvoidflow resistance
Core Design Contradiction:
Illumination intensityVSStress or pressure

Solution Approach 1:

The patent extracts light sources from the fan's airflow path and relocates them to the heat sink's surface. This extraction removes the obstruction caused by light sources within the fan, eliminating flow resistance and turbulence while maintaining light emission functionality for illumination purposes.

Inventive Principle:
Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration improves heat dissipation efficiency and increases brightness and illumination by reducing flow resistance and optimizing the use of light beams, thereby enhancing the overall performance of the heat dissipation unit.

Implementation Method 1

The light source provides a light beam, and the light beam passes the light transmitting plate

Methodology Applied
Scientific EffectLight emission: Light Emitting Diode

Implementation Method 2

the heat dissipating fins are disposed in the heat sink... the flow passes the heat sink to remove heat therefrom

Methodology Applied
Scientific EffectHeat dissipation: Convection

Data Source

PatentUS7883241B2Electronic device and heat dissipation unit thereof
Publication Date: 2011.02.08 ASUSTEK COMPUTER INC
  • US7883241B2 patent drawing
  • US7883241B2 patent drawing
  • US7883241B2 patent drawing

AI summary

A heat dissipation unit is provided. The heat dissipation unit includes a fan, a heat sink and a light source. The heat sink includes a plurality of heat dissipating fins, a light transmitting plate, an air inlet and an air outlet, wherein the heat dissipating fins are disposed in the heat sink, and the light transmitting plate is disposed on a surface of the heat sink. The light source corresponds to the light transmitting plate, wherein the light source provides a light beam, the light beam passes the light transmitting plate and introduces into the heat sink, and introduces out the heat sink through the air outlet.