A strike barrier circuit using a TRIAC and Zener diode enables LED retrofit lamps to interface with fluorescent ballasts.
Inclined air voids in the buffer layer scatter ultraviolet light, resolving total reflection losses at the sapphire interface.
A light-emitting device uses a second substrate to cover through-holes in a first substrate, replacing defective elements while maintaining the original arrangement pattern.
A cutting blade embeds photocatalyst particles to generate hydroxy radicals that oxidize metal layers during dicing.
A light emitting device uses a thermally conductive undercoating to attach the chip directly to a heat conductive layer for rapid heat transfer.
Removing organic resin from the phosphor layer prevents thermal quenching and maintains brightness under high current loads.
Annular finned heat sink dissipates thermal energy from LED sources while a driver circuit adapts HID ballast output for direct socket installation.
Concave and convex curved surfaces in a light distribution adjusting member widen light spread and reduce directivity caused by granular LED arrays.
Light sources mount directly on heat sink surfaces to transmit beams through translucent plates without obstructing airflow.
An integrated bearing holder combines a spring portion and fixing portion to compress the upper support shaft.
A heat sink assembly uses a non-metal-core circuit board to thermally couple solid state components directly to the upper surface.
A microscope illumination system uses spatially arranged LEDs to generate flexible illuminating patterns.