Light Emitting Device Substrate Segmentation for Defective Element Replacement

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Solution Overview

Problem

Conventional light-emitting devices with multiple elements mounted on a substrate face scrapping when one element is defective, as the entire device is discarded rather than just replacing the defective component.

Innovation Solution

A light-emitting device configuration featuring a first substrate with through-holes, where defective elements are removed and covered by a second substrate with matching light-emitting elements, maintaining the original arrangement pattern and preventing debris from causing further defects, using insulating materials for substrates to prevent conductive debris and enhance flexibility for roll-to-roll production.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional light-emitting devices are used with multiple elements mounted on a substrate, then the device can provide illumination functionality, but the entire device must be scrapped when one element is defective

Engineering Contradiction:

Improvedevice reliabilityVSAvoidloss of functional elements

Core Design Contradiction:

ReliabilityVSLoss of substance

Solution Approach 1:

The device is segmented into a first substrate containing defective elements and a second substrate containing replacement elements. The second substrate is attached to cover the through-holes of the first substrate, allowing replacement of defective elements without discarding the entire device. This segmentation enables selective replacement of only the defective portion while preserving functional elements.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Instead of discarding the entire device when one element is defective, the invention recovers the substrate and functional elements by attaching a second substrate with replacement elements. The first substrate is retained and reused, covering only the defective areas with through-holes, thereby recovering most of the original device components.

Inventive Principle:

Principle #34Discarding and recovering

2Ease of manufacture

If the entire device is scrapped when one element is defective, then manufacturing simplicity is maintained, but resource waste increases

Engineering Contradiction:

Improvemanufacturing simplicityVSAvoidwaste of functional elements

Core Design Contradiction:

Ease of manufactureVSLoss of substance

Solution Approach 1:

The manufacturing process is segmented into preparing a first substrate with defective elements and attaching a second substrate with replacement elements. This segmentation allows the replacement process to be as simple as attaching pre-prepared substrates, maintaining manufacturing simplicity while enabling resource recovery.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The second substrate is prepared in advance with replacement light-emitting elements mounted on it. This preliminary preparation allows the replacement process to be straightforward and simple, requiring only the attachment of the pre-prepared second substrate to the first substrate, thus maintaining ease of manufacture.

Inventive Principle:

Principle #10Preliminary action

3Ease of repair

If through-holes are formed in the substrate to remove defective elements, then defective elements can be replaced, but conductive debris may cause further defects

Engineering Contradiction:

Improveelement replacement capabilityVSAvoidconductive debris

Core Design Contradiction:

Ease of repairVSObject-generated harmful factors

Solution Approach 1:

The second substrate acts as an intermediary that covers the through-holes formed in the first substrate. By attaching the second substrate over the through-holes, any conductive debris generated during element removal is isolated and prevented from causing further electrical defects, while still allowing electrical connection through the wiring structure.

Inventive Principle:

Principle #24Intermediary (Mediator)

4Reliability

If insulating materials are used for substrates to prevent conductive debris, then electrical safety is improved, but flexibility for roll-to-roll production is reduced

Engineering Contradiction:

Improveelectrical insulationVSAvoidroll-to-roll production flexibility

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The substrate uses a flexible polyimide film that provides both electrical insulation properties and the flexibility needed for roll-to-roll production. The thin film structure maintains insulating characteristics while allowing the substrate to be processed using flexible roll-to-roll manufacturing techniques, resolving the contradiction between insulation and flexibility.

Inventive Principle:

Principle #30Flexible shells and thin films

Data Source

PatentUS9161458B2Light emitting device and manufacturing method thereof

Publication Date: 2015.10.13 NICHIA CORP

AI summary

A light-emitting device includes a first substrate having a through-hole, a plurality of first light-emitting elements that are arranged on the first substrate, a second substrate that is attached to the first substrate to cover the through-hole of the first substrate, and a second light-emitting element arranged on the second substrate, and electrically connected to wiring of the first substrate.