Toolless Heat Sink Retention Module with Floating Bracket
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Solution Overview
Problem
Existing toolless methods for securing heat sinks to integrated circuits on circuit boards lack flexibility in adjusting the force of contact, making it difficult to optimize heat transfer and potentially damaging solder joints, while traditional tool-based methods are time-consuming for installation and removal.
Innovation Solution
A heat sink retention module with a bracket, coil springs, and a latch that allows the heat sink to be installed toollessly, with the coil springs providing a adjustable force of contact by allowing the bracket to float and the latch securing the heat sink without permanently attached bail latches.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If traditional tool-based methods are used to secure heat sinks, then the force of contact can be controlled, but the installation and removal process becomes time-consuming
Solution Approach 1:
The patent replaces traditional mechanical screw-based fastening systems with a spring-loaded retention mechanism. The coil spring provides continuous contact force to secure the heat sink, eliminating the need for tools during installation and removal while maintaining controllable contact force through spring selection.
Solution Approach 2:
The retention module uses a dynamic spring-loaded system instead of a static fixed-position clamp. The coil spring allows the retention arm to float and adjust to different heat sink thicknesses while maintaining consistent contact force, enabling quick toolless installation and removal.
2Ease of manufacture
If fixed force contact is used to secure heat sinks, then installation is simple, but the solder joints may be damaged due to excessive force
Solution Approach 1:
The patent changes the contact force parameter from a fixed value to a controllable variable through spring selection. By selecting coil springs with appropriate spring rates and pre-loads, the system maintains optimal contact force for heat transfer while staying below the threshold that would damage solder joints.
Solution Approach 2:
The coil spring acts as a cushioning element that absorbs excess force before it reaches the heat sink and integrated circuit. The spring's elastic properties prevent sudden or excessive contact forces that could damage solder joints, while still maintaining sufficient pressure for effective heat transfer.
3Reliability
If adjustable force mechanisms are used to optimize heat transfer, then heat transfer efficiency improves, but the device complexity increases
Solution Approach 1:
The retention module is designed as a universal solution that combines multiple functions: the coil spring provides both the retaining force and the adjustable contact pressure, the retention arm provides both structural support and force transmission, and the latch provides both security and release functionality. This multi-functionality reduces the need for additional components.
Solution Approach 2:
The patent merges the retaining mechanism and the force-adjustment mechanism into a single integrated spring-loaded system. The coil spring simultaneously performs the function of holding the heat sink in place and regulating the contact force, eliminating the need for separate adjustment mechanisms and reducing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables quick and easy adjustment of the force at which the heat sink contacts the integrated circuit, optimizing heat transfer while reducing the risk of damaging solder joints and streamlining the installation and removal process.
Implementation Method 1
The coil springs are inserted within the holes of the bracket. The members are inserted through the coil springs and attachable to the circuit board.
Implementation Method 2
coil springs providing a adjustable force of contact by allowing the bracket to float
Implementation Method 3
Heat from an integrated circuit is transferred to a heat sink, which dissipates the heat away from the integrated circuit.
Data Source
AI summary
An integrated circuit is disposed on a circuit board. A heat sink retention module includes a bracket, members, and coil springs. The members extend through the coil springs and corresponding holes within the bracket to attach to the board. A heat sink is removably installed within the bracket in a toolless manner, such that the heat sink comes into contact with the integrated circuit. The heat sink and the bracket join together to become a single entity that is permitted to float along an axis perpendicular to a surface of the circuit board. The coil springs are tuned to define a predetermined force at which the heat sink is pushed against the integrated circuit. The module can include a latch having tabs bent at different angles relative to one another to balance forces applied by the tabs against the heat sink while the latter is being installed within the bracket.