Heat Slug Pillars for Thermal Management in IC Packages
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Solution Overview
Problem
There is a need for improved, more economical, efficient, and readily manufactured heat spreader systems and package fabrication systems for semiconductor devices to manage increasing heat density in miniaturized electronic devices, as existing solutions have not adequately addressed thermal management challenges.
Innovation Solution
The development of an integrated circuit package system that includes forming heat slug pillars on a substrate, positioning a heat slug on these pillars, and encapsulating the substrate, die, heat slug pillars, and heat slug in a mold compound, with the heat slug support pillars providing elastic and adhesive properties to reduce mechanical stress and enhance thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the molding compound encapsulates the die, then environmental protection is provided, but heat transfer performance deteriorates due to poor thermal conductivity of the molding compound
Solution Approach 1:
The patent divides the package structure into distinct functional zones: a heat dissipation zone with exposed die surface and heat spreader, and a protected zone with molding compound encapsulation. This segmentation allows simultaneous achievement of thermal management and environmental protection in different regions of the package.
Solution Approach 2:
The patent applies different structural configurations to different regions: the upper surface of the die has reduced molding compound for direct heat spreader contact, while other areas maintain full encapsulation for protection. This local differentiation optimizes both thermal performance where needed and environmental protection where required.
2Temperature
If heat spreader is added to improve cooling, then thermal performance improves, but device complexity increases
Solution Approach 1:
The patent combines the heat spreader function with the package substrate by integrating the heat spreader into the substrate structure or directly bonding it to the die. This merging reduces the number of discrete components and simplifies the overall package architecture while maintaining effective heat dissipation.
Solution Approach 2:
The heat spreader is designed to serve multiple functions: it acts as a thermal management component, a structural support element, and potentially an electrical connection layer. This multi-functionality reduces the need for separate components and simplifies the overall device complexity.
3Volume of moving object
If die size is reduced for miniaturization, then device size decreases, but power density increases leading to heat buildup
Solution Approach 1:
The patent addresses the three-dimensional heat management challenge by exposing the upper surface of the die and implementing vertical heat dissipation paths through heat spreaders and thermal vias. This dimensional approach allows effective heat management in miniaturized packages where planar heat dissipation space is limited.
4Temperature
If thermal grease is applied to improve heat transfer, then heat transfer efficiency improves, but manufacturing complexity increases
Solution Approach 1:
The patent eliminates the need for thermal grease by creating direct mechanical and thermal contact between the heat spreader and die through precise machining and bonding processes. This extraction of the thermal grease step simplifies the manufacturing process while maintaining effective heat transfer through direct contact interfaces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a thermally enhanced package that effectively manages heat transfer, reduces mechanical stress, and simplifies the manufacturing process, improving the thermal performance and cost-effectiveness of semiconductor packages.
Implementation Method 1
heat can be transferred efficiently from the die to the substrate
Implementation Method 2
The heat slug support pillars can be made from an elastic material
Implementation Method 3
The heat slug support pillars can be made from an adhesive material
Data Source
AI summary
An integrated circuit package system is provided including providing a substrate having a die attached and electrically bonded thereto. The system includes forming heat slug pillars on the substrate, positioning a heat slug on the heat slug pillars, and encapsulating the substrate, the die, the heat slug pillars, and the heat slug in a mold compound. The system includes singulating the substrate, the die, the heat slug, and the mold compound.