Heat Spreaders for Optical Fiber Array Alignment Under Thermal Stress
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Challenges in attaching flexible fiber array units to rigid carriers in semiconductor devices due to material incompatibilities and adhesion issues, exacerbated by temperature changes and mechanical stresses during installation and use, which affect alignment and assembly integrity.
Innovation Solution
Incorporation of heat spreaders with cavities and adhesive regions to provide strain relief and improved mechanical attachment, featuring cavities for adhesive containment and flow control, allowing for better alignment and attachment of optical fibers to semiconductor devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If flexible fiber array units are attached to rigid carriers, then mechanical support and structural stability are improved, but material incompatibilities and adhesion issues worsen due to differential thermal expansion and mechanical stress
Solution Approach 1:
The patent introduces an intermediary layer between the flexible fiber array unit and the rigid carrier to mediate the mechanical and thermal stress. This intermediate structure absorbs differential expansion and contraction, preventing direct stress transmission that would cause adhesion failure. The intermediary layer acts as a buffer zone that reconciles the incompatible mechanical properties of the two materials.
Solution Approach 2:
The patent modifies the physical and chemical parameters of the attachment interface by incorporating cavities and adhesive regions with specific geometric configurations. These parameter changes include cavity depth, width, and distribution patterns that are optimized to accommodate thermal expansion while maintaining secure adhesion. The adhesive material parameters are also adjusted to match the thermal and mechanical properties of both the fiber array and carrier.
2Ease of manufacture
If traditional attachment methods are used without cavities, then manufacturing simplicity is maintained, but alignment precision and attachment reliability deteriorate under temperature variations
Solution Approach 1:
The cavities are pre-formed in the carrier structure before the fiber array attachment process. This preliminary action creates predetermined alignment features that guide the fiber arrays into precise positions during assembly. The cavities serve as mechanical stops and alignment references, ensuring consistent positioning without requiring complex real-time adjustment mechanisms during manufacturing.
Solution Approach 2:
The attachment interface is segmented into multiple discrete cavity regions rather than a continuous surface. This segmentation allows each cavity to independently accommodate local thermal expansion and stress variations while maintaining overall alignment precision. The divided structure provides multiple localized attachment points that collectively ensure precise fiber positioning under varying temperature conditions.
3Ease of manufacture
If adhesive material is applied without cavity containment, then application simplicity is maintained, but adhesive flow control and attachment consistency worsen
Solution Approach 1:
The cavities provide localized regions with specific geometric properties optimized for adhesive containment and flow control. Each cavity has tailored dimensions (depth, width, shape) that match the adhesive material properties and attachment requirements for specific fiber array positions. This local quality optimization ensures consistent adhesive distribution and bonding quality at each attachment point while maintaining overall manufacturing simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances the assembly process by providing strain relief and improved mechanical attachment, ensuring precise alignment and stability of optical fibers, even under temperature variations and mechanical stress.
Implementation Method 1
Heat spreaders for optical fiber array interconnects
Implementation Method 2
adhesive material on the heat spreader in the first and the second regions comprising cavities wherein adhesive material is in the cavities
Data Source
AI summary
Assemblies comprising semiconductor devices, heat spreaders, and fiber-based input output (IO) connections are provided. Methods of manufacturing assemblies comprising semiconductor devices, heat spreaders, and fiber-based input output (IO) connections are also provided.