Prefabricated Heat Spreader Frame for Semiconductor Die Thermal Dissipation
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Solution Overview
Problem
Semiconductor devices face challenges with heat dissipation and mechanical stress due to poor thermal conductivity of encapsulant or build-up interconnect structures, leading to reduced performance and reliability.
Innovation Solution
A method involving a prefabricated heat spreader frame with a flat plate and perpendicular bodies is used to embed a semiconductor die, accompanied by an encapsulant and a conductive layer to enhance thermal dissipation and reduce mechanical stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If encapsulant or build-up interconnect structures are used to dissipate heat, then the semiconductor device is protected and electrically connected, but thermal conductivity is poor leading to reduced performance and reliability
Solution Approach 1:
The heat spreader is segmented into a frame structure with multiple vertical bodies extending from a flat plate, creating multiple heat dissipation pathways. This segmentation allows heat to be distributed across multiple contact points with the semiconductor die, improving thermal conductivity while maintaining the protective encapsulant structure
Solution Approach 2:
The heat spreader frame acts as an intermediary thermal management component between the semiconductor die and the encapsulant. It provides a thermal conduction pathway that bridges the poor thermal conductivity of the encapsulant material, allowing efficient heat transfer from the die to external heat sinks
2Productivity
If smaller die size is achieved through front-end process improvements, then power consumption is reduced and production efficiency is improved, but manufacturing complexity increases
Solution Approach 1:
The heat spreader frame is prefabricated as a complete assembly with pre-formed vertical bodies and flat plate structure before the semiconductor die is mounted. This preliminary preparation of the thermal management component simplifies the overall manufacturing process by eliminating the need for complex post-die-attachment thermal management modifications
Solution Approach 2:
The heat spreader frame serves multiple functions simultaneously: it provides thermal management, mechanical support, and structural framework for the encapsulant. This multi-functionality reduces the need for separate components, simplifying the manufacturing process despite smaller die sizes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively dissipates heat and reduces mechanical stress, improving the performance and reliability of semiconductor devices by utilizing a prefabricated heat spreader frame with a conductive layer and encapsulant in a wafer level package.
Implementation Method 1
A heat spreader frame includes a flat plate and a plurality of bodies extending vertically from a same surface of the flat plate
Implementation Method 2
Back-end manufacturing involves singulating individual die from the finished wafer and packaging the die to provide structural support and environmental isolation
Data Source
AI summary
A semiconductor device is made by mounting a prefabricated heat spreader frame over a temporary substrate. The heat spreader frame includes vertical bodies over a flat plate. A semiconductor die is mounted to the heat spreader frame for thermal dissipation. An encapsulant is deposited around the vertical bodies and semiconductor die while leaving contact pads on the semiconductor die exposed. The encapsulant can be deposited using a wafer level direct/top gate molding process or wafer level film assist molding process. An interconnect structure is formed over the semiconductor die. The interconnect structure includes a first conductive layer formed over the semiconductor die, an insulating layer formed over the first conductive layer, and a second conductive layer formed over the first conductive layer and insulating layer. The temporary substrate is removed, dicing tape is applied to the heat spreader frame, and the semiconductor die is singulated.