Integrated Heat Spreader Indentations for Thermal Isolation
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Solution Overview
Problem
Microelectronics packages face a thermal dilemma due to heat spreading from high-power primary dies to secondary dies with high power density, leading to elevated junction temperatures and thermal management challenges, particularly when air-cooled solutions are preferred.
Innovation Solution
The use of indentations in the integrated heat spreader, such as narrow slits or channels, to thermally isolate secondary dies from primary dies by controlling heat transfer resistance through variations in indentation depth, width, and thermal conductivity, thereby reducing heat spreading and junction temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If liquid cooling is implemented to improve heat removal, then heat transfer coefficient is increased, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The heat spreader itself provides the thermal management function by incorporating regions with different thermal conductivities directly into its structure. This eliminates the need for separate liquid cooling systems or refrigeration units, allowing the device to self-regulate heat distribution through its inherent material properties and geometry.
Solution Approach 2:
The thermal conductivity parameter of the heat spreader is varied spatially to achieve different thermal management functions in different regions. By changing the material composition or structure of different regions, the heat spreader optimizes heat removal from the primary die while simultaneously protecting the secondary die, without requiring external cooling systems.
2Loss of energy
If high thermal conductivity material is used in heat spreader, then heat removal from primary die is improved, but heat spreading to secondary die increases
Solution Approach 1:
The heat spreader is divided into segments with different thermal conductivity values. The first segment contacting the primary die uses high thermal conductivity material for efficient heat extraction, while the second segment contacting the secondary die uses low thermal conductivity material to block heat transfer and prevent secondary die overheating.
Solution Approach 2:
The heat spreader exhibits spatially varying thermal conductivity, with high conductivity regions positioned to maximize heat removal from heat-generating components and low conductivity regions positioned to provide thermal isolation to heat-sensitive components. This local differentiation of thermal properties resolves the contradiction between heat removal and heat spreading.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces the temperature of high bandwidth memory dies and minimizes heating of primary dies, improving thermal management and maintaining die temperatures within workable limits, even in high-volume manufacturing scenarios.
Implementation Method 1
an integrated heat spreader, the integrated heat spreader thermally coupling the first die to the second die
Implementation Method 2
the first indentation increasing a thermal resistance between the first die and the second die
Data Source
AI summary
Described herein are microelectronics packages and methods for manufacturing the same. The microelectronics package may include a first die, a second die, and an integrated heat spreader. The integrated heat spreader may include a first surface. The first surface may define a first indentation located in between the first die and the second die.