Heat transport device and semiconductor module
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Solution Overview
Problem
Conventional heat transport devices, such as vapor chambers or heat pipes, suffer from reduced heat transport efficiency due to a long distance between the heat receiving portion and the vapor passage, leading to decreased flow velocity of the working fluid and deteriorated vapor diffusion function.
Innovation Solution
The heat transport device is designed with both the wick and vapor passage provided across the heat receiving and radiating portions, reducing the distance between the wick and vapor passage, and incorporating a columnar portion that faces the vapor passage to prevent deformation and maintain capillary force, ensuring high flow velocity and efficient heat transport.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the vapor passage is positioned far from the heat receiving portion, then the structural design is simplified, but the heat transport efficiency deteriorates due to long distance and low flow velocity
Solution Approach 1:
The housing internal space is segmented into distinct heat receiving portion and heat radiating portion, with the wick and vapor passage strategically positioned to optimize heat transport between these segments without requiring complex overall structure
Solution Approach 2:
The vapor passage extends in the thickness direction of the housing, utilizing the Z-dimension to reduce the effective distance for vapor flow while maintaining a simplified planar structure, thereby improving heat transport efficiency without increasing structural complexity
2Manufacturing precision
If the wick structure is made rigid to maintain shape, then the manufacturing precision is improved, but the capillary force is reduced due to deformation prevention
Solution Approach 1:
The wick is designed with different properties in different regions: the distal end portion has higher rigidity to maintain positioning and prevent deformation, while the proximal end portion maintains flexibility to generate sufficient capillary force for fluid transport
3Reliability
If the vapor passage is extended to cover both heat receiving and radiating portions, then the vapor diffusion function is improved, but the device complexity increases
Solution Approach 1:
The vapor passage is designed to serve multiple functions: it acts as both the vapor diffusion path from the heat receiving portion and the heat radiating portion, eliminating the need for separate passages and reducing overall device complexity while maintaining reliable vapor diffusion
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the vapor diffusion function, improves heat transport efficiency, and reduces thermal resistance, effectively dissipating heat generated by the heating element.
Implementation Method 1
a wick forming a capillary passage through which a liquid-phase working fluid flows inside the housing
Implementation Method 2
a vapor passage communicating with the wick inside the housing and through which a gas-phase working fluid flows
Implementation Method 3
a heating element that generates heat by energization
Data Source
AI summary
A heat transport device includes a housing, a wick, and a vapor passage. The housing has a sealed space in which a working fluid is sealed. The wick forms a capillary passage through which a liquid-phase working fluid flows inside the housing. A gas-phase working fluid flows through the vapor passage inside the housing. An outer wall of the housing has a heating element disposing portion on which a heating element is disposed, and a non-disposing portion on which a heating element is not disposed. An internal portion of the housing has a heat receiving portion overlapping with the heating element disposing portion in a thickness direction of the housing and a heat radiating portion overlapping with the non-disposing portion in the thickness direction. Both the wick and the vapor passage are provided to extend over the heat receiving portion and the heat radiating portion.