Heated Diffusion Bonding Element for Large Hermetic Seals
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Solution Overview
Problem
Existing diffusion bonding methods require large furnaces and extensive heating times, limiting their application to small assemblies and consuming significant energy, making them unsuitable for larger components or environments requiring high temperature and pressure seals.
Innovation Solution
A bonding element with a heating element and a bonding structure is used to provide localized heating, allowing diffusion bonding of larger assemblies by compressing and heating the structure between components, eliminating the need for a furnace and reducing energy consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If traditional furnace-based diffusion bonding is used, then bonding of small components is achieved, but the method is unsuitable for larger assemblies and consumes significant energy
Solution Approach 1:
The patent applies localized heating through a heating element positioned in direct contact with the bonding structure, rather than heating the entire assembly in a furnace. This localized approach reduces energy consumption while enabling bonding of larger assemblies, as only the specific bonding region requires elevated temperature
Solution Approach 2:
The bonding process is segmented into distinct functional components: a bonding structure with specific metal surfaces for diffusion bonding, and a separate heating element for localized thermal application. This segmentation allows the heating function to be isolated to only where needed, reducing overall energy requirements while accommodating larger assembly sizes
2Productivity
If traditional furnace-based diffusion bonding is used, then bonding is achieved, but the process requires extended heating times and is limited to small assemblies
Solution Approach 1:
By concentrating heating energy locally at the bonding interface through a dedicated heating element, the patent achieves rapid temperature elevation at the bonding zone without requiring extended heating of entire large assemblies. This localized thermal application reduces heating time while maintaining bonding effectiveness
Solution Approach 2:
The patent replaces the mechanical furnace-based heating system with a direct contact heating element that can be positioned between components. This substitution enables faster, more controlled heating with reduced time requirements, as the heating element can transfer thermal energy directly to the bonding structure without the thermal mass constraints of a furnace
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables diffusion bonding of larger components and environments with high temperature and pressure seals, such as vacuum chambers and large pipe sections, while reducing energy use and eliminating size restrictions.
Implementation Method 1
a heating element (e.g., a resistive heating element) proximate to the bonding structure (e.g., such that the heating element provides localised heating to the bonding structure in use)
Implementation Method 2
Diffusion bonding is a solid-state technique used for permanently joining components. It operates on the principle of solid-state diffusion, wherein the atoms of two solid, e.g. metallic, surfaces intersperse themselves over time.
Data Source
AI summary
A bonding element suitable for diffusion bonding two components includes a sealing structure for locating between the two components; and a heating element connected to the sealing structure and configured to provide local heating to the sealing structure sufficient to cause the sealing structure to diffusion bond to each of the two components and provide a seal between them.