Heated Magnetic Liner Structure for Plasma Shape Control

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Solution Overview

Problem

Existing liner structures in semiconductor manufacturing processes fail to effectively control plasma density and shape while preventing particle deposition, which can deteriorate the quality of semiconductor devices.

Innovation Solution

A liner structure incorporating a heating coil and a magnetic coil, where the magnetic coil is wound multiple times in a vertical direction within the liner body, generating a magnetic field to control plasma density and shape, and the heating coil is used to maintain uniform temperature, preventing particle deposition by ensuring even heat distribution.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a liner structure is used to protect the chamber inner wall from plasma, then the chamber wall is protected, but particles are deposited on the liner structure surface

Engineering Contradiction:
Improvechamber wall protectionVSAvoidparticle deposition on liner
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent applies parameter changes by controlling the temperature of the liner structure through a heating coil. By maintaining the liner surface temperature above the deposition temperature of process particles, the physical state of particle interaction with the liner surface changes, preventing deposition. This temperature parameter control effectively resolves the contradiction between protecting the chamber wall and preventing particle accumulation.

Inventive Principle:
Principle #35Parameter changes

2Productivity

If plasma processing is performed to manufacture semiconductor devices, then semiconductor devices are produced, but plasma density and shape control is insufficient

Engineering Contradiction:
Improvesemiconductor device productionVSAvoidplasma density and shape control
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The patent replaces mechanical or purely geometric plasma confinement methods with a magnetic field-based system. A magnetic coil generates a magnetic field that confines and shapes the plasma, providing precise control over plasma density and distribution. This substitution of magnetic field control for mechanical constraints enables both high productivity and manufacturing precision in semiconductor device fabrication.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively controls plasma density and shape, preventing particle deposition on the liner structure, thereby enhancing the quality of semiconductor devices by maintaining consistent temperature across the liner structure during plasma processing.

Implementation Method 1

a magnetic coil arranged below the heating coil in the liner body and configured to generate a magnetic field

Methodology Applied
Scientific EffectMagnetic field generation: Electromagnetic Induction

Implementation Method 2

a heating coil arranged in the liner body and configured to heat the liner body

Methodology Applied
Scientific EffectJoule heating: Joule Heating

Data Source

PatentUS20240177976A1Liner structure and substrate processing apparatus including the same
Publication Date: 2024.05.30 SYSTEM ENGINEERING MEGA SOLUTION CO LTD
  • US20240177976A1 patent drawing
  • US20240177976A1 patent drawing
  • US20240177976A1 patent drawing

AI summary

Provided is a liner structure including a liner body, a heating coil arranged in the liner body and configured to heat the liner body, and a magnetic coil arranged below the heating coil in the liner body and configured to generate a magnetic field.